Skip to main content
Back to jobs

Staff/Principal Engineer, HIG-HBM Product Engineering (Media Health Manufacturing)

External
MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. logoMicron Semiconductor Asia Operations · 1 North Coast, Singapore
S$90K–S$155K/yrFull-timeUnknown1d ago
CADCross-functional CollaborationData AnalysisLeadershipMentoringVerilog
Cover LetterConnect

Prepare for this interview

Elite

AI-generated questions, company research, and talking points tailored to this role


Responsibilities

  • Optimized Test Coverage: The responsibility of ensuring optimized test coverage on all current and future HIG HBM design architectures and process nodes is a technical aspect of this role. This is crucial for maintaining the effectiveness and efficiency in high-volume manufacturing.
  • Support for New Product Design Validation: The role provides support for design verification and in-depth circuit of new products using CAD tools and Verilog simulations. This technical support is crucial for the development of new products and technologies.
  • Root Cause and Resolution of Manufacturing Test Flow Issue, Qual and RMA Device Issues
  • Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron's competitive edge in the market.
  • Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization.
  • Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.
  • Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.
  • Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.

Requirements

  • Bachelors/Masters Electrical and Electronics Engineering Degree with 7+ years of experience in the semiconductor industry. Product Engineering experience is preferred.
  • Demonstrating Strong Leadership Skills and Technical Skills, especially in problem solving with root cause understanding and solution space through in depth circuit analysis.
  • Good knowledge of statistics and data analysis tools and scripting.
  • Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs).
  • Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.
  • Strong sense of responsibility and accountability towards assigned role with professional work ethic.
  • Excellent communication and presentation skills.
  • Passionate about people leadership, with a drive toward ongoing learning and development in this area.
  • Work on site in Singapore with international travel to US, Taiwan and Japan.

Additional Information

As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron's latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI's Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating.


Your Match

How well this role fits your profile.

Company Intel

What employees say

Worked at MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.? Share your experience

Interested in this role?

Apply on the company's website.

Cover LetterConnect