Lead Engineer

Responsibilities

• Lead the design and planning of semiconductor tool hook-up systems including mechanical, electrical, process, and specialty gas connections.
• Manage end-to-end project execution including scope definition, scheduling, budgeting, and resource allocation.
• Coordinate with cross-functional teams including design engineers, construction teams, vendors, and clients.
• Review and approve engineering drawings, specifications, and technical submittals.
• Ensure compliance with SEMI standards, safety regulations, and cleanroom protocols.
• Oversee installation, testing, and commissioning of wafer fab equipment.
• Identify project risks and implement mitigation strategies.
• Lead project meetings, track milestones, and report progress to stakeholders.
• Support continuous improvement initiatives for engineering and project delivery processes.
• Required Qualifications:
• Bachelor's or Master's degree in Mechanical, Electrical, Chemical Engineering, or related field.
• 8+ years of experience in semiconductor fab engineering, tool installation, or hook-up projects.
• Strong knowledge of cleanroom systems, process utilities (PCW, CDA, VAC, gases, chemicals).
• Experience in project management methodologies (PMI, Agile, or equivalent).
• Familiarity with CAD tools and engineering documentation standards.

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Company Intel

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