Packaging Module Development Engineer

About the role

Join Intel's Advanced Packaging Technology and Manufacturing team and help shape the future of semiconductor packaging. In this role, you will develop and optimize cutting-edge equipment and processes that enable next-generation packaging solutions. Your work will directly impact product performance, manufacturability, and reliability at scale supporting innovations that power computing advancements globally.

Responsibilities

• Key responsibilities will include but not limited to :
• Develop, qualify, and optimize semiconductor packaging equipment and processes to meet quality, yield, cost, and reliability targets
• Apply statistical methods (DOE, SPC) to analyze process performance and drive continuous improvement
• Design and execute experiments to validate packaging technologies under environmental stress conditions (e.g., thermal cycling, humidity, mechanical forces)
• Collaborate cross-functionally with design, manufacturing, and suppliers to ensure scalable and manufacturable solutions
• Define equipment specifications and partner with vendors to meet technical and performance requirements
• Identify and resolve packaging-related reliability issues using data-driven approaches and failure analysis techniques
• Lead technical problem-solving efforts and contribute to process innovation initiatives
• Document findings and best practices through technical reports and knowledge-sharing forums
• Support standardization of qualification processes, quality systems, and engineering methodologies
• Behavioral traits that we are looking for :
• Strong analytical and problem-solving mindset
• Effective written and verbal communication skills
• Ability to work independently and collaboratively in a team environment
• Adaptability in a fast-paced, innovation-driven setting
• Continuous improvement mindset with attention to detail
• Intel invests in our people and offers a complete and competitive package of benefits employees and their families through every stage of life.
• See Intel Benefits for more details.

Requirements

• You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
• Note:
• For information on Intel's immigration sponsorship guidelines, please see
• Intel U.S. Immigration Sponsorship Information
• Minimum Qualifications and Experience :
• Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience. Or a Master's degree in the same field with 2 years of experience and a PhD in the same field.
• Your experience described above must be in the following:
• Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
• Mechanical design software such as SolidWorks or AutoCAD.
• Mechanical drawings and Geometric Dimensioning and Tolerancing.
• Preferred Qualifications and Experience :
• Demonstrated ability to lead technical innovation and manage complex, time-sensitive projects.
• Experience with high-precision manufacturing methods, including stamping and CNC machining.
• Understanding of semiconductor fabrication processes and packaging technologies.
• Familiarity with supply chain management in a manufacturing or materials qualification environment.
• Previous related work experience in a semiconductor foundry preferred.
• Be part of Intel's mission to innovate and advance the future of technology. Apply today to make an impact and shape the future of packaging solutions.
• Job Type:
• Experienced Hire
• Shift:
• Shift 1 (United States of America)
• Primary Location:
• US, Arizona, Phoenix
• Additional Locations:
• Business group:
• Posting Statement:
• Pos

Additional Information

Job Details: Job Description:

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