ASIC Link Modeling Technical Leader

Responsibilities

• Develop system-level behavioral models and comprehensive link simulations for Cisco's silicon photonics systems, enabling performance analysis across high-speed SerDes, optical DSP, and die-to-die interfaces for next-generation 100G/200G/400G per Lambda solutions.
• Lead link budget analysis, channel modeling, and statistical simulations to evaluate jitter, noise, crosstalk, and bit error rate (BER) across transmit and receive paths.
• Define and optimize transceiver architectures including TX/RX equalization (FFE, CTLE, DFE), clock and data recovery behavior, and DSP algorithms through behavioral modeling and simulation.
• Debug complex link simulations, identify architectural bottlenecks, and correlate pre-silicon models with post-silicon lab measurements to validate design performance.
• Collaborate across cross-functional teams to develop IBIS-AMI models, create modeling documentation, and support product release from concept through production.

Requirements

• Bachelors + 12 years of related experience, or Masters + 8 years of related experience, or PhD + 5 years of ASIC link modeling experience
• Proficiency in Python, C/C++, and MATLAB for behavioral model development and automated analysis
• Proven understanding of high-speed communication theory, transmission line theory, SerDes, Ethernet, D2D PHY protocols, and DSP fundamentals
• Demonstrated experience with EDA and SI simulation tools (e.g., Keysight ADS, Synopsys HSPICE, Cadence) and link modeling methodologies
• Analytical, problem-solving, and debugging skills with excellent communication and teamwork abilities
• Preferred experience 8-12 years.
• Experience with optical DSP (ODSP), integrated transceiver features, and PAM4 modulation techniques
• Familiarity with IBIS-AMI model development to support customer & system-level signal integrity simulations
• Experience with Linux-based development environments and scripting automation (Perl, TCL)
• Knowledge of ASIC/SoC design flow, understanding of multi-functional impacts on link performance (packaging, PCB, optics)
• Post-silicon validation experience and correlation of lab measurements with pre-silicon models
• Why Cisco?
• We are Cisco, and our power starts with you.
• Message to applicants applying to work in the U.S. and/or Canada:
• The starting salary range posted for this position is $189,300.00 to $271,500.00 and reflects the projected salary range for new hires in this position in U.S. and/or Canada locations, not incl

Additional Information

The application window is expected to close on: 05/30/2026 Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received . Meet the Team Cisco's Client Optics Group (COG) designs & delivers the high-speed optical transceivers, and platforms that power Cisco's core data center networking solutions. We specialize in the design and integration of innovative IM/DD optics and silicon photonic platforms that enable customers to deploy industry-leading optical technologies within data centers with unprecedented speed, capacity, and reliability. Come join us and take part in shaping COG's ground-breaking optical solutions by designing, developing, and testing some of the most advanced pluggable, and Co-packaged Optics (CPO) being developed in the industry. You will work with Cisco's best-in-class Silicon Photonics team. Our team is responsible for driving the development and optimization of optical transceivers & modules (800G,1.6T & beyond) that seamlessly integrate with Cisco's routing, switching, and datacenter platforms, enabling customers to build scalable, high-performance networks that support emerging technologies including AI/ML workloads, and next-generation data center architectures. We are seeking a hardworking and experienced ASIC Link Modeling Engineer to join our team and be a collaborative modeler for Cisco's silicon photonics systems for next generation products for 100/200/400G per Lambda solutions. You will be a part of a wider team architecting and modeling high-speed SerDes, optical DSP (ODSP), die-to-die (D2D) interfaces, receive and transmit paths in silicon photonics modules and CPO/NPO solutions.

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