Package Architect

About the role

We are looking for a highly driven and technically competent Package Architect to manage internal and subcontractor development activities for new package, technology, and material qualifications, with a strong focus on Power Package platforms. The role requires close collaboration with cross-functional teams, subcontractors, and business groups to deliver robust package and process solutions aligned with business strategies and customer requirements.

Responsibilities

• Serve as Package Architect responsible for developing and qualifying new package, process, and technology solutions for Power Package applications.
• Collaborate closely with internal sites, subcontractors, cross-functional teams, and business groups to support business strategy execution.
• Drive robust package and process integration assessments during the development phase.
• Prepare and present technical reports and technical papers for technology groups.
• Submit invention disclosures and patents related to package and technology innovations.
• Conduct subcontractor selection, technical assessment, and recommendation activities through RFQ evaluations and equivalent technical assessments.
• Lead risk assessment activities in collaboration with subcontractors, internal sites, and business groups.
• Review and validate Design of Experiments (DOE), evaluations, and mitigation plans.
• Ensure proper execution of documented DOE activities, evaluations, and process freezes through hands-on validation and Gemba activities.
• Drive failure analysis investigations and mitigation plans for reliability-related issues.
• Review and ensure alignment of technical reports with company documentation requirements.
• Maintain regular communication and alignment with stakeholders regarding technical gaps, process updates, and project progress.
• Facilitate quarterly or semi-annual subcontractor capability sharing sessions, including roadmap and technology capability reviews.
• Benchmark internal and subcontractor capabilities related to package, equipment, materials, and technology.
• Establish and maintain subcontractor package portfolios and design rule capabilities.

Requirements

• Broad knowledge and strong fundamentals in semiconductor assembly processes including Pre-Assembly, Die Attach, Clip Attach, Wire Bond, Molding, Trim and Form, and Singulation; Final Test experience is an advantage.
• Knowledge of standard semiconductor materials and semiconductor assembly processes.
• Hands-on experience with engineering and quality tools and methodologies such as SPC, DOE, MSA/GRR, 8D, Root Cause Analysis, DFMEA/PFMEA, and Control Plan.
• Strong understanding and practical experience in statistical analysis tools such as JMP, Statistica, and Minitab.
• Working experience with AutoCAD is an advantage.
• Experience working with subcontractors is highly preferred.
• Strong communication and presentation skills.
• Excellent project planning and coordination skills with cross-functional teams.
• Good interpersonal skills and leadership capability, including teamwork and team building.
• Flexible and adaptable to project developments and changing timelines.
• Strong problem-solving and analytical skills.
• Ability to respond quickly and effectively to internal and external customer concerns.
• Demonstrated strong collaboration and stakeholder management skills.

Benefits

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Company Intel

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