Module Development Engineer

Responsibilities

• Lead the design and development of advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
• Drive technology development and enablement for both high-volume manufacturing and future technologies.
• Perform feasibility studies using simulations and engineering methodologies to meet desired device specifications.
• Conduct pathfinding activities to develop innovative process solutions for next-generation device architectures.
• Develop and implement technology roadmaps to guide future manufacturing needs.
• Collaborate with equipment and material suppliers to design and implement enabling process technologies.
• Optimize production efficiency, manufacturing techniques, and output for existing and new products.
• Utilize statistical process control and data analytics to enhance process stability and drive continuous improvements.
• Recommend and execute modifications to operational equipment to boost efficiency and manufacturing scalability.
• Partner with cross-functional teams to ensure alignment on process integration and project deliverables.
• The candidate should demonstrate the following behavioral traits.
• Strong problem-solving skills and ability to address complex technical challenges.
• Proven track record of collaboration with cross-functional teams, including yield, operations, and supplier management.

Requirements

• PhD degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM discipline with 1+ years of relevant experience.
• OR Master's degree in the same fields with 4+ years of experience.
• Experience listed above should be a combination in the following:
• Manufacturing process development experience, statistical process control, process improvement, and data analytics.
• -Hands on experience in wafer-level assembly, semiconductor processing, or advanced packaging technology development.
• Experience in wafer-level assembly, epoxy, mold materials, annealing or related fields in advanced packaging.
• Demonstrated expertise in leading programs from strategy formation to high-volume production.
• Familiarity with advanced packaging technologies such as hybrid bonded interconnects, RDL-based packaging, or ultra-fine pitch solder connections.
• Experience in design rule development for Manufacturability/ REL
• Join Intel's team and help shape the future of semiconductor technology through innovation and excellence.
• Job Type:
• Experienced Hire
• Shift:
• Shift 1 (United States of America)
• Primary Location:
• US, Oregon, Hillsboro
• Additional Locations:
• Business group:
• Posting Statement:
• All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status,

Additional Information

Job Details: Job Description: The Role and Impact As a Module Development Engineer, you will play a pivotal role in driving advancements in Intel's semiconductor manufacturing technologies. Your contributions will focus on developing and enabling cutting-edge processes for high-volume manufacturing while laying the groundwork for future technological innovations. By leveraging your expertise in process development, equipment optimization, and material science, you will be instrumental in creating robust, scalable solutions that align with Intel's commitment to leadership in semiconductor technology. Working cross-functionally with internal teams and external partners, you will ensure seamless integration of advanced manufacturing processes to meet product performance, yield, and reliability standards.

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