Semiconductor Sales & Marketing Manager

Responsibilities

• Deliver quarterly market intelligence reports covering competitive landscape, customer trends, Packaging and HBM roadmaps, and supply chain dynamics
• Develop competitive positioning of glass substrate technology against CoWoS-S/R/L, EMIB, and other advanced packaging solutions
• Build and manage strategic relationships with key accounts (hyperscalers, AI semiconductor companies, etc.)
• Represent Absolics at major industry conferences including ECTC, IMAPS, and SEMICON
• Identify new project opportunities, develop proposals, and drive engagements through to signed agreements
• Lead multiple concurrent customer projects managing timelines, milestones, and cross-functional coordination
• Develop product roadmaps and go-to-market strategies in collaboration with engineering and operations
• Demonstrate superior documentation capabilities across a broad range of materials - from executive reports and competitive analyses to strategic assessments and customer-facing presentations

Requirements

• 7+ years in semiconductor sales, marketing, business related role or product planning
• Experience with advanced packaging technologies (CoWoS, EMIB, 2.5D/3D, glass substrates) preferred
• Understanding of HBM technology and its integration with advanced packaging solutions
• Background at AI semiconductor companies strongly preferred (NVIDIA, AMD, Apple, AWS, Broadcom, etc.)
• Exceptional business writing skills - executive reports, strategic analyses, and customer presentations
• Fluent English required, Korean a plus
• Willingness to travel to customer sites (Silicon Valley, Austin, Phoenix, etc.) and industry conferences
• SALARY:
• $90,000 - $150,000
• BENEFIT:
• 401K 6% matching (NO vesting period)
• Healthcare 100% support (Health, Dental, Vision)
• Life, STD, LTD 100 % support
• Cell phone allowance
• PTO and self-development

Benefits

Additional Information

Sales & Marketing Specialist/Manager - Semiconductor Packaging 7+ years | Covington, GA (Atlanta metro) Absolics is a joint venture between SKC and Applied Materials, developing and commercializing glass substrate technology for next-generation AI/HPC semiconductor packaging. Leveraging superior performance, power efficiency, and thermal management of glass substrates, we work closely with the world's leading chip designers, hyperscalers, and AI semiconductor companies to shape the future of advanced packaging. Role Overview A comprehensive commercial role spanning market intelligence, customer engagement, project management, and strategic documentation - directly supporting the commercialization of our glass substrate platform.

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