Packaging Engineer

Requirements

• Bachelor's degree in Materials Science and Engineering, Applied Physics, Electrical Engineering, Mechanical Engineering, or Computer Science is required. Master's degree is preferred. Internship experience in semiconductor industry is preferred.
• Knowledge and experience in analog IC package and module design, optimization, and manufacturing.
• Knowledge and experience in selecting IC package bill of material (BOM): solid understanding of mechanical, thermal, and electrical properties of materials, including semiconductors, metals, ceramics, and polymer composites.
• Package model and drawing creation: solid skills/experience in CAD tools are desired to create package design models and drawings for package development, simulation, and documentation.
• Experienced in Python, machine learning, and image analysis.
• Experienced in data analysis.
• Package-level and system-level thermal/mechanical/electrical/magnetic simulation skill is a plus.
• EEO is the Law: Notice of Applicant Rights Under the Law .
• Job Req Type: Graduate Job
• Required Travel: Yes, 10% of the time
• The expected wage range for a new hire into this position is $86,480 to $118,910. Actual wage offered may vary depending on work location , experience, education, training, external market data, internal pay equity, or other bona fide factors.
• This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
• This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time , and other benefits.

Benefits

Additional Information

Come join Analog Devices (ADI) - a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing new breakthrough technologies that transform lives. At ADI you will work alongside the brightest minds to collaborate on solving complex problems that matter from autonomous vehicles, drones and factories to augmented reality and remote healthcare. ADI fosters a culture that focuses on employees through beneficial programs, aligned goals, continuous learning opportunities, and practices that create a more sustainable future. About Analog Devices Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X . Job Description Summary We are looking for a highly motivated Packaging Engineer who will drive IC package and module development activities for ADI's new and existing products. This position will be based in San Jose, CA . Job Description IC package design: design and optimize IC packages for a wide range of ADI products, using common and advanced analog IC package platforms and assembly/bumping processes. Power module and system design: design and optimize power modules for performance, manufacturing, and reliability. Design automation: responsible for package-level, module-level, and system-level design automation. Assembly subcontractor/OSAT management: work closely with ADI's oversea assembly subcontractor/OSATs for new package development and other package-related engineering activities. Late afternoon/early evening conference calls are expected. Cross functional team collaborations: work closely with internal reliability team, business units, and supply chain management team to provide package engineering support. Project management: plan and drive package development projects.

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