Software Development and AI for Chip Package Board Codesign (w/m/div)
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Infineon Technologies Austria Ag · Villach, KärntenFull-timeOn-site3w ago
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Software Development and AI for Chip Package Board Codesign (w/m/div) WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problemsolvers behind tomorrow's technology. Being responsible for Software Development and AI for Chip Package Board Codesign on our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you...
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