Skip to main content
Back to jobs

PDE PIE (Package Integration Engineering) Senior Engineer/Engineer

External
Micron Technology logoMicron Technology · Singapore
Full-timeOn-site6d ago
Cover LetterConnect

Prepare for this interview

Elite

AI-generated questions, company research, and talking points tailored to this role


About the role

Position Overview The PIE (Package Integration Engineering) Engineer works closely with multi‑functional groups (TPM/PMO-BU, TD, DESIGN, CEM, Site Engineering) to execute new product transfer from NPN to high volume manufacturing. Success is measured by timely BU project readiness for DC/ES/QS/Stick build, first‑time and on‑time package qualification releases, and ramping the product to minimum predefined yield and quality targets from NPI‑LVM while meeting 100% of handover criteria. Key Respon...


Your Match

How well this role fits your profile.

Company Intel

What employees say

Worked at Micron Technology? Share your experience

Interested in this role?

Apply on the company's website.

Cover LetterConnect