Principal Plating Engineer

Requirements

• Bachelor's degree and seven (7) years of experience appropriate to the area of assignment/field; OR, Any equivalent combination of experience and/or training from which comparable knowledge, skills and abilities have been achieved.
• Job Profile Summary:
• Leads complex projects, and provides technical guidance, innovation, design, and expertise to enhance the institution's engineering solutions and infrastructure. May provide instruction/teaching.
• Job Description:
• Position Salary Range:
• Depends on experience
• This position is funded by DoD and requires candidates to meet the definition of US person as defined in as defined by 22 C.F.R. § 120.62 and 15 C.F.R. § 772.1.
• Essential Duties:
• Maintain electroplating equipment by supporting operations, increasing equipment up time, responding to production issues, keeping the equipment under statistical control, and reducing costs.
• Assist students, faculty, and other professionals with service requests
• Recommend, scope, and assist in the procurement and installation of future equipment into the Core.
• Cross-train in other areas to provide backup and assistance as needed.
• Write procedures to help students and other users safely use the equipment.
• Provide supervision and guidance to the users of the Core.
• Provide supervision to junior engineers.
• Regular activities include ability to quickly change priorities which may include and/or are subject to resolution of conflicts.
• Ability to clearly communicate and exchange accurate information to perform essential duties.
• Preferred:
• MS in Chemical Engineering, Materials Engineering, Physics or related discipline
• Demonstrated understanding of the operation and maintenance of electroplating processing equipment
• Strong interpersonal, written and verbal communication skills
• Strong customer service skills
• Computer knowledge used for documentation and analysis.
• Demonstrated strong mechanical aptitude and experience with statistical software packages such as JMP or Minitab.
• Demonstrated experience with active matrix TFT processing and amorphous-silicon processes.
• Demonstrated experience with semiconductor advanced packaging processing.
• Experience with many disciplines including etching, deposition, cleaning, and other thin film processing.
• Equipment maintenance experience.
• Working Environment:
• Flexible work options:
• Alternative work schedules can include four, 10-hour workdays in a workweek; a nine-day, 80-hour schedule over two workweeks for exempt employees only; and staggered st

Benefits

Additional Information

Job Profile: Engineer 4 Job Family: Engineering Time Type: Full time Max Pay - Depends on experience: $130,000.00 USD Annual Apply before 11:59 PM Arizona time the day before the posted End Date.

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Company Intel

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