Sr Staff Package Design Engineer

Responsibilities

• Design and develop power package and interconnect for Renesas's packaging needs in the areas of power QFN, HSON, HSOT and TOLL for AI data center and Automotive.
• Work with OSAT/Internal manufacturing especially collaboration with Malaysia and Japan PKG team to develop, run DOE to optimize processes and establish process specification.
• Work with Product groups and QA team to define target of package structure/design, develop new package and processes, and qualify packages within required period.
• Ensure smooth transition into production by establishing robust design and process through the DOE results, verification, and resolving issuesduring development period.
• Develop and maintain technical expertise on advances and innovations in advanced power package design, process, and interconnect that linked and execute pkg roadmap.
• Doctoral / Master's / Bachelor's degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
• 5-12 years of relevant experience in package development emphasizing Power package design and assembly process development.
• Understanding of semiconductor power device package assembly processes, materials, and technology. Knowledge of die bond, clip bond, wire-bonding, flip chip . Knowledge of SPC and statistical analysis, AutoCAD, PowerPoint, Excel, Word.
• Strong interpersonal and communication skills.
• Strong analytical and presentation skills.
• Strong proactive attitude towards tackling challenges with enthusiasm.
• Willingness to take ownership and lead in any challenge without giving up achieving goal
• At Renesas, you can:
• Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.
• Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people's lives easier, safe and secure.
• Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day.
• Are you ready to own your success and make your mark?
• Join Renesas. Let's Shape the Future together.

Benefits

Additional Information

We are actively driving advanced package technology and developing power package with focusing on next generation technologies for AI data center and automotive. To achieve the rapidly growing demand and expedite release to market of power packages, we are developing such as Power QFN, HSON, HSOT and TOLL. This role offers the opportunity to work on, higher density, lower resistance, higher reliability, and high thermal dissipation package design and develop technologies.

Your Match

How well this role fits your profile.

Company Intel

What employees say

Worked at Renesaselectronics? Share your experience