Senior/Principal Process Integration Engineer for NAND Flash

Responsibilities

• Lead the architecture design (e.g. memory cells, select transistors, and peripheral devices), process integration, electrical characterization, modeling and simulation, failure analysis for 3D NAND devices.
• Design and execute DoE, analyze the impact of process variations on device performance and reliability (such as durability and data retention), and propose improvement solutions.
• Collaborate with the process development team to assess new device architectures, driving technology iteration.
• Write detailed technical reports and support customers or internal teams in resolving related technical issues.
• Required Qualifications:
• Education: Master's degree or above
• Major: Microelectronics, physics, material science & engineering, chemistry;
• Other Requirements:
• 8+ years of semiconductor device work experience, 3+ years of 3D NAND work experience.
• In-depth knowledge of 3D NAND device physics, familiar with its principles, failure modes, and reliability mechanisms.
• Troubleshooting, and problem-solving capabilities, with experience in successfully improving device performance or yield.
• Familiar with advanced semiconductor manufacturing processes and integration flows.
• Strong cross-team communication and collaboration skills.

Your Match

How well this role fits your profile.

Company Intel

What employees say

Worked at BRIGHTECS INNOVATION PTE. LTD.? Share your experience