Process Engineer

Responsibilities

• Own and drive advanced process modules (e.g., lithography, wet/dry etch, metal/passivation deposition, wafer thinning).
• Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies.
• Drive new process integration (NPI) and process transfer to high-volume manufacturing.
• Perform root cause analysis and implement robust corrective/preventive actions.
• Define process control plans, SPC strategies, and OCAP execution.
• Collaborate cross-functionally with equipment, integration, quality, and R&D teams.
• Mentor junior engineers and technicians.
• Interface with suppliers on process and material improvements.

Requirements

• Bachelor's or Master's degree in Engineering (Electrical, Chemical, Materials, or related).
• 8-12 years of semiconductor wafer fab process experience.
• Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools.
• Demonstrated leadership in cross-functional technical projects.
• Strong analytical, problem-solving, and communication skills
• Preferred
• PhD in Engineering (Electrical, Chemical, Materials, or related).
• Six Sigma certification (Green/Black Belt).
• Experience supporting 4" to 6" wafer scaling or equivalent manufacturing transition.
• If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Additional Information

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: Job Summary Lead process development, optimization, and transfer to manufacturing to achieve yield, quality, cost, and reliability targets.

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Company Intel

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