Module Development Defect Inspection Engineer

Requirements

• Minimum qualifications are required to be initially considered for this position.
• Bachelor's degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Chemistry, or related STEM field with 5+ years of experience.
• OR Master's degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Chemistry, or related STEM field with 4+ years of experience.
• OR PhD degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Chemistry, or related STEM field.
• Experience listed above should be a combination of the following:
• Semiconductor processing, wafer-level assembly, or cleanroom environments.
• Process development methodologies, statistical process control, and manufacturing process improvement.
• Technical expertise in module engineering or fab process/hardware technology development.
• Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
• Strong metrology fundamental understanding and development experience.
• Experience with packaging processes, equipment automation development, or project management.
• Demonstrated expertise in leveraging data analysis tools for process optimization and continuous improvement.
• Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
• Join Intel and take advantage of this opportunity to innovate, collaborate, and shape the future of semiconductor technology. Apply now to become an integral part of Intel's dynamic and forward-thinking team.
• Job Type:
• Experienced Hire
• Shift:
• Shift 1 (United States of America)
• Primary Location:
• US, Oregon, Hillsboro
• Additional Locations:
• Business group:
• Posting Statement:
• Position of Trust
• N/A

Benefits

Additional Information

Job Details: Job Description: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enables both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs path-finding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmaps. Recommends and implement modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap. The ideal candidate should show the following behavioral traits: Driven to advance Intel´s strategic priorities and enable meaningful progress within the industry. Strong collaboration skills with cross-functional teams, including yield and operations.

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