Senior Engineer, Process Engineering

Requirements

• Good in reporting (RCA / A3 / OPL).
• Strong Problem-solving skills and good Root Cause Analysis/Finding using 5M + 1E, 5 whys, DMAIC, 8D approach/methodology.
• Familiarize with Failure Mode Effects Analysis (FMEA), Control Plan, Statistical Process Control (SPC), 8D Problem Solving, 6 Sigma certification, Minitab, JMP.
• Good project planning, strong sense of quality and urgency.

Additional Information

ESSENTIAL DUTIES AND RESPONSIBILITIES: Maximize wire bond process capability to handle wide range of product portfolio. Drive for Wire Bond process yield improvement and monitoring. Drive for Wire Bond related test QDN investigation and improvement plan. Drive for wire bond related improvement projects. Hand-sake with NPI team on new technology / product / wire bond methodology transfer to mass production. Liaise and work with equipment team on equipment related improvement and new machine qualification. Project management in project related to wire bond yield improvement, cost saving and process efficiency. REQUIRED: Min Bachelor or higher Engineering degree (Chemical engineering, Mechanical Engineering, data science engineering & etc) Min 2 years of working experience in Semiconductor Process development & sustaining. Wire bond process engineering/ NPI engineering background. Strong communication and coordination skills to work effectively with a cross functional team. Knowledge in Semiconductor assembly backend processes. PREFERRED: Wire bond process knowledge will be in advance. Know well in data automation. Excellent in technical problem solving methodology.

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Company Intel

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