Optical Packaging & Assembly Engineer

Responsibilities

• Support the design and rapid prototyping of optical packaging solutions for PIC-based quantum hardware.
• Develop and implement fibre-to-chip alignment and attachment processes for high-performance optical coupling.
• Assist in the design of scalable packaging architectures, working alongside senior engineers.
• Collaborate with mechanical and electronic engineers to ensure integrated, manufacturable designs.
• Work closely with quantum physicists to support the build and testing of optical quantum systems.
• Contribute to the development of assembly workflows, processes, and documentation.
• Support component selection, procurement, and BOM development for prototype builds.
• Analyse experimental results and provide feedback to improve packaging performance and robustness.
• Experience/Qualifications:
• PhD in Physics, Engineering, or a related discipline (or equivalent experience).
• Hands-on experience with optical assembly, fibre alignment, or opto-mechanical systems.
• Familiarity with photonic integrated circuits and optical packaging techniques.
• Experience working in a laboratory environment supporting experimental hardware development.
• Strong problem-solving skills and ability to work in a fast-paced R&D setting.

Requirements

• Experience with fibre arrays, optical connectors, or precision alignment systems.
• Knowledge of DFM principles for optical packaging.
• Experience working in cross-functional engineering teams.
• Familiarity with optical measurement and characterization techniques.
• Note: PsiQuantum will only reach out to you using an official PsiQuantum email address and will never ask you for bank account information as part of the interview process. Please report any suspicious activity to recruiting@psiquantum.com .
• We are not accepting unsolicited resumes from employment agencies.
• The ranges below reflect the target ranges for a new hire base salary. Actual compensation may vary out

Benefits

Additional Information

PsiQuantum's mission is to build the first useful quantum computers-machines capable of delivering the breakthroughs the field has long promised. Since our founding in 2016, our singular focus has been to build and deploy million-qubit, fault-tolerant quantum systems. Quantum computers harness the laws of quantum mechanics to solve problems that even the most advanced supercomputers or AI systems will never reach. Their impact will span energy, pharmaceuticals, finance, agriculture, transportation, materials, and other foundational industries. Our architecture and approach is based on silicon photonics. By leveraging the advanced semiconductor manufacturing industry-including partners like GlobalFoundries-we use the same high-volume processes that already produce billions of chips for telecom and consumer electronics. Photonics offers natural advantages for scale: photons don't feel heat, are immune to electromagnetic interference, and integrate with existing cryogenic cooling and standard fiber-optic infrastructure. In 2024, PsiQuantum announced government-funded projects to support the build-out of our first utility-scale quantum computers in Brisbane, Australia, and Chicago, Illinois. These initiatives reflect a growing recognition that quantum computing will be strategically and economically defining-and that now is the time to scale. PsiQuantum also develops the algorithms and software needed to make these systems commercially valuable. Our application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact. Quantum computing is not an extension of classical computing. It represents a fundamental shift-and a path to mastering challenges that cannot be solved any other way. The potential is enormous, and we have a clear path to make it real. Come join us. Job Summary: PsiQuantum is building the world's first fault-tolerant quantum computer, enabled by large-scale photonic integration. We are seeking an Optical Packaging & Assembly Engineer to join our UK R&D facility at Daresbury Laboratory. In this role, you will work closely with a senior engineer to rapidly develop and prototype next-generation optical packaging solutions for photonic integrated circuits (PICs). You will collaborate across mechanical, electronic, and quantum hardware teams to enable the assembly and testing of cutting-edge optical quantum computing systems.

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