Senior Engineer, Semiconductor Packaging

Requirements

• PhD or Master's degree in Electrical Engineering, Mechanical Engineering, or Materials Science.
• 2+ years of hands-on experience in semiconductor packaging development or manufacturing.
• Good understanding of IC packaging materials and their mechanical, thermal, and electrical behaviors.
• Strong knowledge of IC package structures, substrate technologies, and semiconductor assembly processes.
• Hands-on experience with electrical simulation tools such as EMPro, ADS, Sigrity, HFSS, or similar tools.
• Familiarity with RLC extraction, signal integrity, power integrity, electromagnetic simulation, and circuit simulation.
• Experience with Cadence Allegro is a plus.
• Strong communication skills and the ability to work effectively in cross-functional and global teams.
• EEO is the Law: Notice of Applicant Rights Under the Law .
• Job Req Type: Experienced
• Required Travel: Yes, 10% of the time
• Shift Type: 1st Shift/Days
• The expected wage range for a new hire into this position is $95,600 to $131,450. Actual wage offered may vary depending on work location , experience, education, training, external market data, internal pay equity, or other bona fide factors.
• This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
• This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time , and other benefits.

Benefits

Additional Information

About Analog Devices Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X . This role will focus on the development of advanced packaging solutions for semiconductor devices across multiple market segments. The packaging solutions must meet demanding product performance, reliability, manufacturability, and cost requirements. Candidates will be expected to: Drive and support the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products. Perform electrical simulations of IC packages, modules, or systems using commercial simulation tools. Work closely with cross-functional teams to understand product and packaging requirements, identify customer needs, and resolve complex technical issues. Collaborate with OSAT partners and substrate suppliers to resolve technical issues, drive process development, optimize manufacturing processes, and improve yield. Work with quality and reliability teams to establish reliability criteria for semiconductor products across various market applications. Develop and maintain package design guidelines, process specifications, and technical documentation.

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