Senior/Principal Engineers (Advance Packaging Development)

About the role

Work on cutting-edge advanced packaging platforms Strong technical growth in a fast-evolving space About Our Client Our client is a global semiconductor technology leader at the forefront of advanced memory solutions. With a strong culture of innovation, integrity, and sustainability, the organization invests heavily in next-generation process development and empowers. Engineers are trusted to own critical modules, interact directly with global stakeholders and vendors, and contribute meaningfully to next‑generation technology scaling. With a strong commitment to sustainability, integrity, and community engagement, the organization balances innovation with responsibility-creating a workplace where top technical talent can build enduring careers. Job Description Drive development of advanced packaging technologies across: 🔹 Wafer-Level Engineering Develop and optimize wafer-level packaging processes (e.g. WLP, FO-WLP, RDL) Drive process improvements in lithography, bumping, and wafer preparation Enhance yield, performance, and manufacturability at wafer stage 🔹 Die-Level Engineering Develop and improve assembly processes such as flip-chip, die attach, and underfill Troubleshoot process issues related to alignment, bonding, and reliability Drive continuous improvement in packaging performance and yield 🔹 Integration Engineering Lead end-to-end process integration across wafer and die-level packaging Analyze yield and reliability issues across the full packaging flow Collaborate cross-functionally to ensure successful technology deployment The Successful Applicant Bachelor's, Master's, or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, or related field At least 5 years of experience in semiconductor process or packaging engineering Experience in advanced packaging technologies (e.g. WLP, flip-chip, assembly, integration) Strong problem-solving skills and ability to work across multiple teams What's on Offer You will have the opportunity to work on cutting-edge advanced packaging technologies that power next-generation semiconductor products, with real impact on high-performance and memory solutions. This role offers strong technical depth and career growth, exposure to end-to-end development from wafer to final package, and the chance to collaborate with global engineering teams in a fast-evolving environment. In addition, the position comes with a competitive compensation package (including bonuses), comprehensive health and insurance coverage, and flexible benefits. You'll be part of a highly innovative and collaborative culture that values engineering excellence, while enjoying career progression opportunities, continuous learning, and the stability of a large-scale manufacturing environment driving future technology roadmaps. Contact Timothy Huang (Lic No: R1980928/ EA no: 18S9099) Quote job ref JN-062026-7047534 Phone number +65 6416 9863 Michael Page International Pte Ltd | Registration No. 199804751N

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Company Intel

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