Chief Failure Analysis Engineer

About the role

The Chief Failure Analysis Engineer performs advanced failure analysis to determine root causes of product performance deviations using appropriate physical, electrical, and material characterization techniques. This role provides end-to-end failure analysis support across production, customer returns, reliability stress failures, and engineering requests to identify, isolate, and drive resolution of non-conformances.

Responsibilities

• Perform advanced failure analysis (FA) to identify root causes using electrical, physical, and material characterization techniques.
• Deliver accurate FA results within defined cycle time (CT) and turnaround time (TAT) targets while maintaining high-quality reporting standards.
• Utilize industry-standard FA tools (e.g., SEM, TEM, X-ray, SAM, EDX, FTIR) for fault isolation, data interpretation, and failure mechanism identification.
• Drive continuous improvement initiatives to enhance FA lab efficiency, capability, tool utilization, and cost performance.
• Monitor FA metrics and implement corrective actions to improve throughput, reduce repeat analyses, and close performance gaps.
• Ensure compliance with EHS, ESD, and quality standards while maintaining proper documentation and reporting practices.
• Identify systemic issues through trend analysis and support corrective and preventive actions (CAPA) to prevent recurrence.
• Provide technical leadership, mentoring, and training to FA technicians and operators.
• Collaborate with cross-functional teams (Process, Product, Reliability, Quality) to resolve failures, improve yield, and strengthen product reliability.
• Review and approve FA reports, equipment qualifications, and consumables in accordance with governance and compliance standards.

Requirements

• Bachelor's or Master's degree in Engineering, Physics, Chemistry, or a related field.
• At least 10 years of experience in the semiconductor or electronics industry, preferably in Failure Analysis.
• Background in manufacturing, quality, assembly engineering, or packaging R&D is an advantage.
• Hands-on experience with FA tools and techniques (e.g., SEM/EDX, TEM, X-ray, SAM/CSAM, laser opening, cross-sectioning, decapsulation).
• Strong knowledge of semiconductor device physics, packaging technologies, and failure mechanisms.
• Ability to analyze and interpret electrical, physical, and material data.
• Proven root cause analysis and problem-solving skills using structured methodologies (e.g., 8D, DMAIC).
• Data-driven with experience in statistical analysis and tools such as Excel, JMP, or Minitab.
• Knowledge of quality systems and standards (e.g., ISO, ESD, EHS compliance).
• Familiarity with Lean/Six Sigma (Green Belt preferred) and continuous improvement practices.
• Strong communication, collaboration, and technical reporting skills.
• Highly detail-oriented with the ability to manage multiple priorities in a fast-paced environment.

Benefits

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Company Intel

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