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Senior Technologist, Hardware Development Engineering -

External
Westerndigital logoWesterndigital · Roseville, CA
Full-timeOn-site1mo ago
AssemblyComplianceFPGARoutingSSO
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About the role

We are seeking an Expert-level Hardware Engineer who is equally strong in board-level hardware design and ASIC interface / integration (I/O, package, power integrity, DFT/test, analog, and signal integrity). This is a hands-on role for a recognized subject matter expertise in delivering complex hardware from concept through production, including deep lab bring-up and root-cause complex issues, able to debug across silicon, package, and board. REQUIRED Professional hardware engineering experience. Proven ownership of multiple complex programs through the full lifecycle: architecture → design → build → bring-up → debug → qualification → production ramp → sustaining. Demonstrated, hands-on experience spanning both: Board/system hardware design (schematic ownership, layout partnership, bring-up, debug, standards compliance, manufacturing support) ASIC I/O and integration (I/O architecture decisions, package/substrate considerations, PI/SI co-design, tape-out support, DFT/test hooks) Cutting-Edge High-Speed Interfaces Hands-on experience integrating and debugging leading-edge Ethernet and PCIe interfaces, including: 100G/200G Ethernet PAM4 transceivers (system/channel design, equalization concepts, BER/PRBS testing, standards compliance planning and test) PCIe Gen 6 (system/channel design, equalization concepts, BER/PRBS testing, standards compliance planning and test) Demonstrated ability to design and simulate high-speed links across die/ASIC package/PCB/connectors/cabling, balancing SI/PI/EMI and manufacturing constraints. FPGA Board Design Proven experience designing complex boards using cutting-edge FPGAs (e.g., high-end families with high-speed transceivers), including: Power architecture and sequencing for FPGA multi-rail systems High-speed transceiver channel design, with associated reference clock design, reset/boot/strap Bring-up and debug using vendor tools, link training, PRBS/IBERT-style testing, and lab correlation Ownership of FPGA-based platform bring-up from first power-on through high-speed link validation and system integration. AMD FPGA Knowledge preferred Board-Level Design Expert schematic design and review for high-complexity boards (compute/networking/accelerator-class or equivalent). Strong experience with: Multi-rail power distribution networks (frequency domain impedance control, sequencing, fault handling) High-speed interfaces (DDR, PCIe, Ethernet/SerDes-based links, USB, I2C, SPI, MIPI-based on product needs) Controlled impedance trace design (understanding manufacturing and cost tradeoffs) Clocking/reset/fault tolerant architectures and debug access design General analog circuit design Proven partnership with layout teams to define and enforce: Stackups, reference planes, return paths, via design and strategy, routing constraints Differential pair controlled impedance routing, channel constraints, connector strategy, manufacturability Signal Integrity (SI) & Power Integrity (PI) Across Die / Package / Board SI design experience: Insertion loss, return loss, eye/jitter concepts, electrical noise abatement, termination, discontinuities, correlation of models to measurements. Deep PI/PDN experience: target impedance approach, decap strategy, anti-resonance mitigation, transient response, measurement and correlation. Practical EMI/EMC grounding/shielding/filtering understanding grounded in design and lab realities. ASIC I/O, Package, and Power Co-Design Ability to own or co-own ASIC I/O choices: I/O standards, voltage domains, ESD strategy, drive/slew tuning, noise coupling/SSO considerations Strong understanding of package/substrate impacts: Pinout/ballout tradeoffs, escape routing constraints, lane swapping realities Package parasitics effects on SI/PI and timing margins Thermal/mechanical considerations influencing reliability and assembly Power architecture competence spanning system and ASIC-aware constraints (noise isolation, domain partitioning, bring-up hooks). DFT / Test Strategy Bridging Silicon ↔ Board ↔ Manufacturing Strong working knowledge of DFT concepts and productization: JTAG/boundary scan, scan/ATPG fundamentals, BIST/loopbacks/PRBS, on-chip monitors/telemetry Experience defining debug and manufacturing test strategy: Test access, test point strategy, coverage vs SI impact, failure analysis workflows Analog & Mixed-Signal Practical Depth Practical capability to own/review analog subsystems relevant to high-performance designs: Clock generation/distribution and jitter sensitivity Filtering/biasing, stability fundamentals, measurement integrity/noise coupling Mixed-signal partitioning and grounding strategy Hands-On Lab Debug Expectations Expert in structured bring-up and root-cause debug: Creation and execution of EVT test plan High-speed measurement competence (Oscilloscopes, BERT, network analyzers, spectrum analyzers, probing strategy, fixtures, de-embedding awareness) Ability to correlate bench measurements back to simulation and drive corrective actions Tools &


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