Senior Engineer, Packaging Engineering

Requirements

• Exceptional problem-solving skills with expertise in experimental design and statistical analysis
• Excellent communication skills, enabling collaboration with global functional teams

Additional Information

ESSENTIAL DUTIES AND RESPONSIBILITIES: You will work as SiP (System In Package ) package integration engineer in packaging engineering group. Leads new SiP product development from concept design and qualification to mass production. Generate innovative product concepts and transform them into tangible, market-ready products. Work closely with global functional teams in US, India, China, and Taiwan, review feasibility design drawings and propose design options. Collaborate extensively with internal teams, validate design options through characterization builds, perform comprehensive DFx (Design for x) analysis, Product performances , Quality , Cost , Manufacturability and etc, as well as review mechanical and electrical simulations, initiate assembly process flow, and deliver most optimized design for manufacturing with yield and quality. Ensuring build readiness, execute package qualification plan, follow up package reliability status, investigate and close failures on time. Monitor assembly and test yield on engineering/customer sample and low volume production builds. Drive yield improvement and manage excursions. Lead new product from low volume to high volume production transition with yield and quality meeting goals. Ensure FMEA, SOD, Control Plan, recipe guideline, SPC and other assembly controls are ready prior to high volume production. Lead new technology transition (new wafer tech/process/material) from engineering stage to volume production. REQUIRED: Master's degree in Material Science, Polymer Science, Mechanical Engineering, or other engineering disciplines or Bachelor' degree with minimum 2 years of relevant work experience PREFERRED: Proficient understanding of packaging domains in semiconductor SiP assembly ( DP / DA / WB / Mold & backend process), packaging materials and failure analysis. Additional knowledge in areas like board level reliability , FEA ( Finite Element Analysis ) will be added advantages Self-motivated and self-directed Strong work ethic, capable of performing effectively under high-pressure situations, and maintaining composure in the face of uncertainties

Your Match

How well this role fits your profile.

Company Intel

What employees say

Worked at Sandisk? Share your experience