Design Engineer (Semiconductor Assembly)

Responsibilities

• Define requirements and features for semiconductor equipment
• Develop concepts and architecture of new equipment
• Design mechanical systems which involve the selection and use of motors, actuators, gear drives, pumps and valves.
• Produce detailed engineering drawings
• Perform design verification and validation testing to ensure compliance with specifications, safety regulations and product requirements.
• Improve design of legacy machines
• Application of analysis tools like Fish Bone Diagram, FMEA etc.

Requirements

• Degree in Mechanical or Mechatronics Engineering
• More than 3 years of experience in automation design
• Good knowledge and experience in the following areas :
• Design of automation or semiconductor equipment
• High precision machine design
• Design of High Speed Pick and Place mechanisms
• Familiar with 3D CAD software
• Equipment troubleshooting skills
• Ability to produce detailed Mechanical drawings and apply knowledge of Geometric Dimensioning &Tolerancing.
• Able to travel overseas for field support when required
• Must be prepared to work overtime when necessary
• To find out more about this opportunity, please contact Lionel Liew at lionel.liew@gmprecruit.com .
• We regret that only shortlisted candidates will be notified.
• GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: LionelLiew | Registration No: R1330693

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Company Intel

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