IC Package Design Technical Leader

Responsibilities

• Beyond technical leadership, you will help shape methodologies, improve development flows, and strengthen cross functional collaboration across Cisco's global silicon organization, while fostering a culture of collaboration, accountability, and continuous improvement.
• Lead complex package design programs, planning and driving schedules from concept through implementation and tapeout.
• Optimize package pinouts, stack-ups, power distribution, and high-speed routing, balancing performance, manufacturability, and reliability.
• Collaborate with silicon floor planning, signal integrity (SI), and power integrity (PI) teams to ensure design quality and system-level alignment.
• Work closely with layout editors and implementation teams to deliver high-quality package layouts aligned with interface and manufacturing requirements.
• Serve as the technical and organizational leader of the San Jose package design team, providing direction, mentorship, and technical guidance to engineers.
• Develop and grow package design capability within the team, mentoring engineers and enabling them to take ownership of increasingly complex package programs.
• Coordinate resources across designers, layout editors, and contractors to support efficient project execution.
• Enhance package design methodologies and partner with vendors to improve product quality and efficiency.
• Drive innovation in package solutions for Cisco's next-generation ASIC platforms.

Requirements

• Bachelor's degree in electrical engineering or a related field with 12+ years of work experience or Master's degree in Electrical Engineering or a related field with 8+ years of work experience
• Experience in high-speed package design, including signal integrity considerations and power distribution networks (PDN).
• Experience with industry-standard EDA tools for package layout and design.
• Experience with technical leadership in complex hardware or silicon development programs.
• Extensive experience in ASIC package design, including pinout optimization and high-speed routing.
• Knowledge of silicon floor planning and strong collaboration with SI and PI teams.
• Experience leading or mentoring engineering teams and developing technical talent.
• Experience coordinating complex cross-functional hardware development programs.
• Experience with testing and measurement equipment (oscilloscopes, TDR/VNA analyzers).
• Experience with scripting languages such as Python, Perl, TCL, or shell programming
• Why Cisco?
• We are Cisco, and our power starts with you.
• Message to applicants applying to work in the U.S. and/or Canada:

Additional Information

The application window is expected to close on: 07/06/2026 Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received . Meet the Team The Common Hardware Group (CHG) creates innovative hardware platforms central to the AI era, powering Cisco's core Switching, Routing, and Wireless products for organizations globally. Our innovations in silicon, optics, and hardware platforms-like Silicon One-are shaping the technology industry. We're a global team of creative experts, bringing our unique backgrounds and bold ideas to push boundaries and help each other grow. Because full product development-from design to qualification to production-is within our team, we're able to think differently, experiment more, and work quickly. Join us to power the future of the digital world.

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