Package and PCB Layout Eng

Responsibilities

• Design, develop, and optimize RF HW, including PCB and Package Layout, for applications such WLAN, Bluetooth.
• Define floorplans, layouts, and physical designs for RF circuit architecture and ensure compliance with design rules and manufacturing constraints.
• Collaborate with cross-disciplinary teams to integrate silicon, package, and board-level designs as part of a co-design optimization process.
• Provide ownership of PCB layout from component placement to final output, supporting manufacturing and assembly processes.
• Implement design rules for specific substrate/PCB technologies, ensuring compliance with DRC and DFM requirements.

Requirements

• Bachelor's or BS degree in Electrical Engineering, Mechanical Engineering, or a related field, or equivalent experience as per business and job requirements.
• 6+ years of experience
• Proficiency in Cadence Allegro and experience with board layout, package layout, and package technology.
• Strong knowledge of RF fundamentals, including electromagnetic theory, communication theory, and RF system analysis.
• Experience with circuit simulation tools and debugging techniques.
• Familiarity with physical design for debugging and signal/power integrity analysis.
• Understanding of design rules, design for manufacturability (DFM), and design rule checks (DRC).
• Experience with RF physical design for wireless products, including Si-Package-Board co-design optimization.
• Knowledge of mentor CAD tools, AutoCAD, and/or SolidWorks.
• Demonstrated ability to solve complex problems and work collaboratively within cross-functional teams.
• Strong communication skills to effectively engage with multiple stakeholders and project teams.
• Experience in designing and optimizing circuits for wireless communication products to achieve the highest performance, quality, and cost efficiency.
• Join us to shape the future of wireless technology and take your career to the next level. Apply today and be part of a team that's redefining innovation in the RF design space.
• Job Type:
• Experienced Hire
• Shift:
• Shift 1 (Israel)
• Primary Location:
• Israel, Haifa
• Additional Locations:
• Israel, Petah-Tikva
• Business group:
• Silicon and Platform Engineering Group (SPE): Deliver breakthrough silicon and platform solutions that deliver industry-leading products today while also defining the next generation of computing experiences.
• Posting Statement:
• Position of Trust
• N/A
• Work Model for this Role
• This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
• *

Additional Information

Job Details: Job Description: We are seeking an RF Design Engineer to join our cutting-edge team and contribute to the development of innovative radio frequency (RF) solutions that power next-generation technologies. As an RF Design Engineer, you will play a critical role in designing, developing, and verifying complex RF integrated circuits and systems. Your expertise will directly influence the performance and quality of our wireless communication products, enabling advancements across industries. If you are passionate about RF design and want to shape the future of wireless technology, this is your opportunity to make a significant impact.

Your Match

How well this role fits your profile.

Company Intel

What employees say

Worked at Intel? Share your experience