Principal Package Thermal & Mechanical Engineer

Responsibilities

• Thermal & Mechanical Modeling Leadership
• Define and drive thermal and mechanical modeling strategies for advanced packages (FCBGA, FCCSP, multi-die, and chiplet-based architectures)
• Perform detailed thermal simulations including steady-state and transient heat transfer (conduction, convection, and interface resistances such as TIM1/TIM2)
• Develop and deploy compact thermal models (CTM), reduced-order models (ROM), and DELPHI-based models for system-level integration
• Analyze power density, hotspot behavior, and package-to-system thermal interactions across air and liquid cooling environments
• Perform thermo-mechanical stress/strain analysis including CTE mismatch, viscoelastic material behavior, and deformation
• Predict package warpage across process and use conditions (reflow, underfill cure, board attach, field operation)
• Model solder joint reliability and fatigue using industry standard models
• Package Architecture & Thermal Design Strategy
• Drive package design decisions including material selection (EMC, substrate, TIM, lid/heat spreader), thermal path optimization, and early-stage architecture definition across air and liquid cooling solutions (air, cold plate, CPO/CPC)
• Conduct DOE, sensitivity studies, and worst-case analysis to guide tradeoffs across performance, cost, reliability, and manufacturability
• System Co-Design & Automation
• Partner cross-functionally to drive chip-package-board co-design and resolve system-level thermal/mechanical challenges, including system integration constraints
• Serve as a technical interface for customers and internal teams, translating modeling results into actionable insights and leading design reviews and issue resolution
• Develop and scale modeling methodologies, workflows, and BKMs; mentor engineers and improve efficiency through automation and scripting (Python, MATLAB)

Requirements

• M.S. or Ph.D. in Mechanical Engineering, Materials Science, Electrical Engineering, or related field
• 8+ years of experience in semiconductor packaging with strong focus on thermal and mechanical modeling
• Deep expertise in thermal modeling and simulation, including steady-state and transient analysis, compact thermal modeling (CTM), DELPHI methodology, and system-level thermal integration using tools such as ANSYS Icepak, Flotherm, or equivalent
• Deep expertise in thermo-mechanical modeling and FEA simulation, including stress/strain analysis, warpage prediction, and reliability modeling (BLR/CLR), using tools such as ANSYS Mechanical, or equivalent
• Proven ability to correlate simulation results with lab measurements
• Experience influencing package design and delivering solutions to production
• Strong cross-functional collaboration across package design, SIPI, system, and manufacturing teams
• Experience with high-power AI / HPC packages and large FCBGA (>50mm)
• Familiarity with advanced packaging technologies:2.5D / 3D integration, Chiplet, CPO/CPC
• Experience with system-level cooling solutions: Liquid cooling, cold plates, immersion cooling
• Knowledge of JEDEC standards and reliability qualification methodologies
• Experience working with OSATs and substrate vendors on thermal/mechanical design optimization
• Proficiency in scripting (Python, MATLAB) for modeling automation
• Exposure to multi-physics

Benefits

Additional Information

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs' Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company's COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company's custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com . Role Overview As a Principal Package Thermal & Mechanical Engineer at Astera Labs, you will serve as a technical leader driving the development and modeling of advanced IC packaging solutions that enable next-generation AI and high-performance connectivity systems. In this highly visible role, you will define and execute thermal and mechanical modeling strategies across the chip-package-board system, influencing package architecture, material selection, and reliability design. You will partner closely with package design, SIPI, silicon, system, and manufacturing teams to ensure robust thermal/mechanical performance and first-pass success. You will also drive modeling methodologies, correlation strategies, and best-known methods (BKMs), while engaging directly with customers to translate complex simulation insights into actionable system-level solutions.

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