Technology Development Engineer (Advanced Packaging)
External
United Microelectronics (singapore Branch) · Pasir Ris Drive 12, SingaporePrepare for this interview
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About the role
We are looking for a skilled OSAT & AdvancedPackaging Engineer to drive Advanced packaging with external OSAT partners.This role will focus on advanced packaging technologies, ensuring high-quality,cost-effective, and timely product delivery while collaborating withcross-functional team. Job Responsibilities: Work on 2.5D/3D packaging platform technologies. Develop bump, underfill, molding and RDL processes. Collaborate with internal R&D and OSAT partners to driveHeterogeneous Integration. New advanced packaging process verification and qualification. Customer engagement and new product verification Capability Knowledge of bumping, molding, dicing, bonding, RDL (RedistributionLayer), and interconnect technologies are plus. Experienced in 2.5D and 3DIC process development are plus. Skill on FMEA, control plan, DOE (design of experiment) and problemsolving. Good communication, self-motived and avid learner Qualification Atleast bachelor degree in electronics/electrical/physics/Materials engineeringor other relevant fields. At least 2 years working experience inOSAT R&D/Packaging/Process engineer or other relevant fields. ProficientEnglish oral and writing skill.
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