ASIC Engineering Analog Design Leader - high-speed optical transceiver circuits (modulator drivers, TIAs, CDRs, PLLs, ADC/DAC) - 12+ years, Bangalore

Responsibilities

• As a High-Speed Analog/Mixed-Signal (AMS) Design Leader, you will play a pivotal role in shaping next-generation silicon photonics driver ICs.
• You will:
• Lead full-chip electrical architecture, specifications, and execution for high-speed silicon photonics driver ICs (100G/200G/400G per lambda)
• Own end-to-end mixed-signal design for both transmit and receive paths, including high-speed datapath and low-speed control circuits
• Design and optimize critical building blocks such as modulator drivers, TIAs, serializers, PLLs, and control loops
• Drive performance across power, speed, signal integrity, testability, and cost
• Partner cross-functionally with optical, system, and product teams to align design with real-world deployment requirements
• Define and execute verification and validation strategies from concept through production
• Lead silicon bring-up, debug, and lab validation-resolving complex system-level challenges and improving yield
• Influence architecture decisions and contribute to next-gen product roadmaps
• Mentor engineers across analog, digital, and validation domains, fostering technical excellence and innovation

Requirements

• Bachelor's + 12 years, Master's + 8 years, or PhD + 5 years of experience in high-speed analog/mixed-signal design
• Strong expertise in high-speed optical transceiver circuits (modulator drivers, TIAs, CDRs, PLLs, ADC/DAC)
• Proven experience leading designs through full tapeout cycles and delivering successful silicon
• Hands-on proficiency with industry tools such as Cadence Virtuoso, Spectre, Calibre, Verilog/SystemVerilog, or Verilog-AMS
• Experience in scripting and automation using Python or C
• Ability to make critical technical decisions in ambiguous, fast-paced environments
• 10-15 years of deep hands-on experience in analog/mixed-signal IC design
• Experience with silicon photonics driver ICs and direct-detect optical architectures
• Strong understanding of silicon photonics, optical subsystems, and industry standards (QSFP/QSFP-DD, IEEE 802.3)
• Expertise in high-speed PHYs and protocols (112G/224G PAM4 SerDes, Ethernet, UCIe, CDR systems, PLLs)
• Experience in design for testability (DFT) and developing test methodologies for large mixed-signal systems
• Hands-on lab experience with high-speed measurement equipment (BERTs, oscilloscopes, communication analyzers)
• Familiarity with SI/PI analysis, PCB/test fixture design, and optical component modeling (photodiodes, modulators, Verilog-A)
• Strong collaboration skills with the ability to work across global, cross-functional teams
• Why Cisco?
• We are Cisco, and our power starts with you.

Additional Information

Cisco's Client Optics Group (COG) designs & delivers the high-speed optical transceivers, and platforms that power Cisco's core data center networking solutions. We specialize in the design and integration of cutting-edge IM/DD optics and silicon photonic platforms that enable customers to deploy industry-leading optical technologies within data center with unprecedented speed, capacity, and reliability. Come join us and take part in shaping COG's ground-breaking optical solutions by designing, developing, and testing some of the most advanced pluggable, and Co-packaged Optics (CPO) being developed in the industry. You will work with Cisco's best-in-class Silicon Photonics team. Our team is responsible for driving the development and optimization of optical transceivers & modules (800G,1.6T & beyond) that seamlessly integrate with Cisco's routing, switching, and datacenter platforms, enabling customers to build scalable, high-performance networks that support emerging technologies including AI/ML workloads, and next-generation data center architectures. We seek an experienced High Speed AMS Design Engineer to lead full-chip electrical specifications and mixed-signal design for Cisco's silicon photonics driver integrated circuits supporting 100G/200G/400G per Lambda solutions. You will own high-speed datapath and low-speed control circuit design for receive and transmit paths in our next-generation silicon photonics modules.

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