Design Engineer - Chip Floorplanner

Responsibilities

• Define and optimize top-level floorplan architecture, including die size estimation, hierarchy definition, and partitioning.
• Drive macro placement, power grid design, clock distribution planning, pin placement, and feedthrough optimization.
• Collaborate closely with RTL, timing, and packaging teams to balance performance, power, and area (PPA) targets.
• Lead top-level timing closure, congestion analysis, and ECO implementation to ensure clean tapeout readiness.
• Coordinate with block owners and integration teams for smooth block-level to top-level convergence.
• Support cross-functional design integration, providing guidance and technical support to internal and external partners.
• Apply a deep understanding of block PnR, timing closure, physical verification, and IR/EM analysis to achieve signoff-quality results.
• Contribute to design flow automation and methodology development for advanced process technologies.
• Technical Skills / Background
• Strong foundation in VLSI design principles and ASIC physical design fundamentals.
• In-depth experience with floorplanning, die partitioning, and hierarchical design.
• Working knowledge of PLLs, clock networks, power delivery, and timing-critical structures.
• Familiarity with physical verification, DRC/LVS, and congestion/power analysis.
• Proven ability to drive PPA optimization through innovative layout and planning strategies.
• Coding & Tool Proficiency
• Strong experience with TCL scripting and Linux environments is required.
• Proficiency in Python, Perl, or Ruby is preferred.
• Experience with Cadence or equivalent physical design tools is highly desirable.
• Collaboration and Leadership
• Excellent communication, organizational, and problem-solving skills.
• Ability to work effectively with customers and cross-functional teams across global sites and time zones.
• Skilled at organizing and presenting large data sets, managing multiple priorities efficiently.
• Exercises independent judgment and strong engineering insight in defining methods, techniques, and evaluation criteria.
• Provides technical leadership, mentors others, and leads execution of new initiatives.
• Education and Experience
• BS in Electrical or Computer Engineering with 12+ years of relevant experience, or
• MS in Electrical or Computer Engineering with 10+ years of relevant experience.
• Additional Job Description:
• Compensation and Benefits
• The annual base salary range for this position is $127,100 - $203,400.
• This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
• If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Benefits

Additional Information

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: Be part of the Custom Silicon Design Team within Broadcom's ASIC Products Division in beautiful Fort Collins, Colorado. Join a world-class engineering group developing custom CMOS ASICs for cutting-edge AI, Cellular, Networking, Computing, and Storage products. This position offers the opportunity to work on high-performance SoC designs operating at speeds exceeding 1 GHz, from concept through production. Role Overview This Floorplanning Engineer role focuses on chip-level physical architecture and integration for advanced ASICs in deep sub-micron technologies. The position provides hands-on experience with the latest 3 nm and smaller process nodes, defining and optimizing the overall die layout, including partitioning, hierarchy, and placement of major functional blocks, memories, and I/O structures for AI, computing, and networking SoCs.

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