Senior Packaging Engineer, Material Engineering

Requirements

• Strong oral and written communication skills.
• Strong analytical, problem-solving, and critical thinking skills to address complex challenges.
• Demonstrated strong work ethic.
• Ability to work in a global team environment and interact with other engineers to define and implement experiments and provide material solutions to support advanced packaging technology development.

Additional Information

ESSENTIAL DUTIES AND RESPONSIBILITIES In this position, you will work in the Material Engineering team within the Packaging R&D organization who owns and deploys best-in-class material engineering solutions to the top-edge product and technology development across advanced semiconductor packaging, flash memory product and host levels. Your essential duties and responsibilities include: Drive advancement in packaging materials by addressing material-related design and process challenges. Develop solutions to support next-generation package requirements, including smaller form factors, thinner die, higher interconnect density, increased power, and enhanced reliability. Lead the evaluation, development, and qualification of advanced packaging materials for both product development and high-volume manufacturing. Ensure compliance with industry standards and sustain high material quality to enable reliable, high-yield, and cost-efficient manufacturing. Responsible for material characterization, lab testing, and design of experiments (DOE) to simulate manufacturing processes and use-condition failure. Analyze thermal, mechanical, and environmental performance to ensure materials meet reliability and performance targets. This position will interface with package and product design (in particular, thermal and mechanical), reliability, failure analysis, assembly R&D, and process teams to define material requirements and solutions. Collaborate with suppliers to develop, optimize, and qualify materials for successful production integration. REQUIRED Master's, or PhD in Materials Science or related engineering field. Minimum 5 years of experience in semiconductor packaging, materials engineering, or related industries. Solid knowledge through academic coursework or experience required in Materials Science and Engineering or related areas. Strong background in material characterization and/or material mechanics with emphasis on failure analysis and design of experiment. Strong understanding of packaging materials system (e.g., polymers, adhesives, laminates, EMC, substrates). Familiarity with industry standards and reliability test methods (ASTM, JEDEC). Experience working in cross-functional working environments. PREFERRED Working knowledge in various material testing and characterization instruments. Good understanding of general semiconductor packaging processes, materials, technology and trends, such as molding, wire-bonding, die attach, flip chip, SMT, etc. Experience in supplier engagement and sustainability-driven material development is an advantage.

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Company Intel

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