Engineer - QEM PQE Electrical Failure Analysis

Requirements

• Bachelor's / Master's Degree in Electronics/Microelectronics/Material Science/Physics/Applied Science
• Excellent problem-solving and analytical skills.
• Proven ability to communicate effectively both written and verbal to all level.
• Proven ability in multi-tasking complex projects and driving them to completion.
• Strong teamwork skills and the ability to build strong peer relationships
• Knowledge of Circuit analysis and layout tracing, Yield analysis and failure mechanisms
• Strong understanding of NAND memory operation and architecture, CMOS device physics and wafer fabrication processes
• Hands-on experience in Electrical failure analysis, bench characterization, Probe testing and test flow understanding, Data analysis and DOE methodology
• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.
• Embody Micron's core values:
• People - Respect, develop, and empower others
• Innovation - Drive continuous improvement and breakthrough thinking
• Tenacity - Show grit and determination
• Collaboration - Build trust and foster teamwork
• Customer Focus - Deliver excellence and value

Additional Information

As a QEM PQE Electrical Failure Analysis (EFA) Engineer, you will be responsible for driving deep technical understanding and resolution of yield, quality, and reliability challenges for advanced NAND memory products manufactured in Fab10. You will support both new product introduction (NPI) and high-volume manufacturing (HVM) by performing die-level electrical analysis, failure mode construction, and innovative characterization to enable robust product qualification and continuous yield improvement. Leveraging strong knowledge in device physics, probe testing, and wafer fabrication processes, you will identify root causes of electrical failures and translate insights into actionable test, process, and design improvements to enhance product performance and outgoing quality. Job Responsibility: Perform electrical failure analysis (EFA) using bench characterization to identify failure mechanisms at die, circuit, and transistor levels Construct failure models and root cause understanding for yield excursion, reliability issues, and customer return cases Design and execute bench DOE and probe engineering experiments to validate hypotheses and drive yield/quality improvement Translate characterization results into test, process, or device optimization solutions to improve yield, reliability, and product quality Conduct circuit and layout tracing analysis to correlate electrical failure signatures to physical/process limitations Support NPI qualification and HVM issue resolution, ensuring timely product release and manufacturing stability Drive data-driven yield improvement programs through close collaboration with cross-functional teams (PI, TD, PE, TSE, YE) Troubleshoot complex issues across test conditions, probe limitations, and device design interactions Develop custom test conditions, scripts, and methodologies for advanced failure validation and experiment execution Contribute to process capability improvement and cost reduction initiatives by resolving abnormal manufacturing behaviors Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one's scope of work.

Your Match

How well this role fits your profile.

Company Intel

What employees say

Worked at MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.? Share your experience