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Engineer, HIG HBM, Product Engineering (Media Health Reliability)

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MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. logoMicron Semiconductor Asia Operations · 1 North Coast, Singapore
S$60K–S$83K/yrFull-timeUnknown1w ago
Cross-functional CollaborationData AnalysisMentoringMovePythonRisk Management
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Responsibilities

  • Reliability Test Flow Development: Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects.
  • Reliability Test Plan and Execution: Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution.
  • DPM reduction : Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI's Quality, Cost and Cycle Time
  • Risk Management: The role requires communication with Product Managers/Leads to manage risks associated with DPM process conversions. This is crucial in ensuring that the conversions move at an appropriate pace, balancing the need for innovation with the need for stability and reliability.
  • Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron's competitive edge in the market.
  • Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization.
  • Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.
  • Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.
  • Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.

Requirements

  • Bachelor's or Master's degree in Electrical and Electronics Engineering or a related field.
  • Experience in semiconductor devices, circuit design, or product validation is a plus.
  • Solid understanding of problem-solving methodologies, with a focus on identifying root causes and exploring solution spaces.
  • Familiarity with CMOS technology, DRAM architecture, and basic device physics.
  • Exposure to data analysis, statistics, and scripting tools such as Python or JMP.
  • Strong attention to detail and a commitment to quality.
  • Ability to work effectively in team-based projects, contributing to shared goals and outcomes.
  • Flexible and eager to learn, with a willingness to take on diverse roles in a dynamic engineering environment.
  • Responsible and accountable, with a professional work ethic and ownership of assigned tasks.
  • Clear and effective communication skills, especially when articulating technical concepts and findings
  • Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

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