Quantum Process Integration Lead (BEOL)
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About the role
QuantWare is building the world's most powerful quantum processors to solve humanity's greatest challenges. We do this with our unique VIO™ technology, the only QPU architecture that breaks the hardware barriers that have held quantum computing back, unlocking the path to MegaQubit quantum processors. With VIO, we are paving the way for the hyper-scale quantum computers that will change the world. And delivering on that vision demands people who don't shy away from tackling the hardest challenges of our time. That's where you come in! As a Quantum Process Integration Lead (Back end of line) , you'll play a crucial role in developing our state of the art assembly technologies of quantum processors in our advanced multi-layer chip stack architecture. These components development aims to achieve best in class quantum computing performance which are in turn integrated in our VIO technology. You will define fabrication and process development projects, design of experiments, and ensure seamless integration and optimisation of all technical components. Your work will be essential as we scale to increasingly complex systems and deliver on the promise of quantum computing.
Responsibilities
- Plan and lead the development of back-end fabrication and assembly technologies, with a focus on enhancing the flip chip bonding techniques, contacts reliability, and manufacturability of quantum processors to our architecture chip stack.
- Develop and coordinate integration test plans in collaboration with cross-functional teams.
- Lead the definition and formalisation of assembly-centric fabrication and process development across the organisation.
- Establish scalable, well-documented integration procedures to support system growth.
- Investigate and resolve integration issues and technical anomalies, ensuring alignment with specifications and overall performance targets.
- Your Profile
- 4+ years of experience in chip assembly development of deep-tech or low-volume technology, preferably flip chip in quantum computing.
- Hands-on experience with back end process-flow development, and specifically UBM, hard-stops, bumps, detachable contacts / MEMS, flip-chip technologies.
- A background in superconducting qubits is a significant plus.
- A background in physics, microwave/RF/electrical engineering, or a related field (PhD is a plus)
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Company Intel
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