Staff Semi Packaging Engineer

Requirements

• Master's degree in Materials Science and Engineering, Applied Physics, Electrical Engineering, or Mechanical Engineering is required with at least 3 years of industrial working experience in related fields. PhD. degree is preferred.
• In-depth knowledge and experience in analog IC package and module design, optimization, and manufacturing.
• Knowledge in IC package reliability requirements, failure analysis techniques, assembly process issues, etc.
• Knowledge and experience in selecting IC package bill of material (BOM): solid understanding of mechanical, thermal, and electrical properties of materials, including semiconductors, metals, ceramics, and polymer composites.
• Package model and drawing creation: solid skills/experience in CAD tools are desired to create package design models and drawings for package development, simulation, and documentation.
• Package process development: experienced in manufacturing control plan, process failure mode and effects analysis (FMEA), process change notification (PCN), statistical process control (SPC), and design of experiment (DOE).
• Package-level and system-level thermal/mechanical/electrical/magnetic simulation skill is a plus.
• EEO is the Law: Notice of Applicant Rights Under the Law .
• Job Req Type: Experienced
• Required Travel: Yes, 10% of the time
• Shift Type: 1st Shift/Days
• The expected wage range for a new hire into this position is $130,168 to $188,490. Actual wage offered may vary depending on work location , experience, education, training, external market data, internal pay equity, or other bona fide factors.
• This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
• This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time , and other benefits.

Benefits

Additional Information

About Analog Devices Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X . We are looking for a highly motivated Packaging Engineer who will drive IC package and power module development activities for ADI's new and existing products. This position will be based in San Jose, CA. Job Description Advanced package platform development: drive the development and adoption of advanced IC package platforms and processes, such as embedded package and fan-out wafer-level package. IC package design: design and optimize IC packages for a wide range of ADI products, using common and advanced analog IC package platforms and assembly/bumping processes. Power module design: design and optimize power modules for performance, manufacturing, and reliability. Package design rule: define, maintain, and advance package design rules for emerging package platforms and power modules. Assembly subcontractor/OSAT management: work closely with ADI's oversea assembly subcontractor/OSATs for new package development and other package-related engineering activities. Late afternoon/early evening conference calls are expected. Cross functional team collaborations: work closely with internal reliability team, business units, and supply chain management team to provide package engineering support. Project management: plan and drive for on time delivery of package development projects.

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