ASIC High Speed AMS Technical Leader
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Responsibilities
- Provide technical leadership in analog/mixed-signal design for Cisco's next generation silicon photonics driver integrated circuits for 100G/200G/400G per Lambda solutions.
- Lead full-chip electrical specifications, circuit design, and verification test plans from concept through production, coordinating across electrical, optical, and product teams.
- Author mixed-signal datapath designs including photonics modulator drivers, serializers, PLLs, TIAs and control circuits while optimizing for power, performance, testability, and cost.
- Debug complex silicon and system-level issues during bring-up, and lab validation phases, driving yield enhancements and failure analysis.
- Mentor and guide analog, digital, and validation engineers while collaborating with architecture and product teams on verification and testability strategies.
Requirements
- Bachelors + 12 years of related experience, or Masters + 8 years of related experience, or PhD + 5 years of high-speed AMS design experience
- Demonstrated expertise in high-speed optical transceiver design (modulator drivers, TIA, CDR, PLLs, ADC/DAC) and proficiency with industry standard tools (Cadence Virtuoso, Spectre, Caliber, SystemVerilog, Verilog-AMS)
- Demonstrated ability to lead design teams through full tapeout cycle, making critical decisions with limited data and delivering successful silicon products
- Proficiency in Python or C for design automation, scripting, and analytical tools
- 10-15 years of analog/mixed signal circuit design experience
- Experience with silicon photonics driver ICs and direct-detect optical module architectures
- Strong understanding of silicon photonics, optical subsystems, MSA standards (QSFP/QSFP-DD), and IEEE 802.3 specifications
- Expertise in multiple high-speed PHYs, protocols and subsystems (SerDes 112Gbps/224Gbps PAM4, Ethernet, UCIE, clock and data recovery systems, PLLs, ADC/DAC circuits)
- Demonstrated experience in design for testability (DFT) and test methodology development for large mixed-signal designs
- Proven experience with lab instrumentation (digital communication analyzers, real-time scopes, BERTs), SI/PI and test fixture/PCB
- Familiarity with optical sub-component models (photodiodes, modulators) and Verilog-A modeling for AMS simulations
- Strong collaborator and teammate with the ability to work across teams in multiple sites
- Why Cisco?
- We are Cisco, and our power starts with you.
- Message to applicants applying to work in the U.S. and/or Canada:
- The starting salary range post
Additional Information
The application window is expected to close on: 06/30/2026 Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received . Meet the Team Cisco's Client Optics Group (COG) designs & delivers the high-speed optical transceivers, and platforms that power Cisco's core data center networking solutions. We specialize in the design and integration of innovative IM/DD optics and silicon photonic platforms that enable customers to deploy industry-leading optical technologies within data center with unprecedented speed, capacity, and reliability. Come join us and take part in shaping COG's ground-breaking optical solutions by designing, developing, and testing some of the most advanced pluggable, and Co-packaged Optics (CPO) being developed in the industry. You will work with Cisco's best-in-class Silicon Photonics team. Our team is responsible for driving the development and optimization of optical transceivers & modules (800G,1.6T & beyond) that seamlessly integrate with Cisco's routing, switching, and datacenter platforms, enabling customers to build scalable, high-performance networks that support emerging technologies including AI/ML workloads, and next-generation data center architectures. We are seeking an experienced High Speed AMS Design Engineer to lead full-chip electrical specifications and mixed-signal design for Cisco's silicon photonics driver integrated circuits supporting 100G/200G/400G per Lambda solutions. You will own high-speed datapath and low-speed control circuit design for receive and transmit paths in our next-generation silicon photonics modules.
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