Advanced Packaging Senior Engineer

Requirements

• Bachelor's degree in Electrical Engineering with 3 - 5 years of related professional experience or Master's/PhD in Electrical Engineering with 1-3years of experience.
• Familiarity with IC package or PCB layout tools like Cadence APD, Xpedition Package Designer.
• Familiarity with packaging technologies, materials, package substrate design rules and assembly rules.
• Understanding of advanced 2.5D/3D package technology including (a) CoWoS-S/R/L, (b) EMIB, (c) CPO, (d) CPC.
• Hands-on design experience on flip chip packages, 2.5D or 3D is a plus.
• Familiar with interpreting electrical simulation results such as IR Drop reports and S-parameter data, ability to run basic checks.
• Good English (spoken and written).
• Able to organize their work to meet specific milestones.
• Able to work and collaborate in team.
• Expected Base Pay Range
• 152,700 - 203,600, RON per annum
• The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.
• Additional Compensation and Benefit Elements
• All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.
• Interview Integrity
• To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
• #LI-AB1

Additional Information

About Marvell Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact The Marvell - Central Engineering Packaging organization drives semiconductor IC package development from concept to mass production and is responsible for supporting customers with advanced custom package designs that meet challenging electrical requirements. Many of the new designs are requiring multi-chip and multiple component configurations driving advanced technology requirements. There is the excitement of always working on new projects and cutting-edge technologies. What You Can Expect Evaluating design feasibility based on given package topology, design rules and electrical requirements. Hands on physical implementation of the package design. Close interaction with electrical simulation team to optimize the design to meet electrical requirements. Close interaction with the operations team and fabrication suppliers to meet design for manufacturing requirements. Other layout related tasks, such as tool evaluations, flow development, libraries usage and maintenance.

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