Skip to main content
Back to jobs

ADCE Packaging Design Architect

External
Intel logoIntel · Arizona, Phoenix
Full-timeOn-site2w ago
AssemblyComplianceDocumentationLeadershipPCB DesignPhoenix
Cover LetterConnect

Prepare for this interview

Elite

AI-generated questions, company research, and talking points tailored to this role

Requirements

  • Ph.D./master's in electrical engineering/ chemical engineering/ mechanical engineering or Material Science.
  • 10+ years and in-depth knowledge/background in Package, PCB design, or IC digital design.
  • Job Type:
  • Experienced Hire
  • Shift:
  • Shift 1 (United States of America)
  • Primary Location:
  • US, Arizona, Phoenix
  • Additional Locations:
  • US, Oregon, Hillsboro
  • Business group:
  • Posting Statement:
  • Position of Trust

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .Annual Salary Range for jobs which could be performed in the US: $220,920.00-311,890.00 USDWork Model for this RoleThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*Health insurancePaid time offEquity / stock optionsPerformance bonus

Additional Information

Job Details: Job Description: Drives end-to-end development for substrate design from concept through tape out and implements physical layout and routing of the package design. Performs substrate fit and routing studies to establish design, performance, and cost tradeoffs. Works closely with silicon and hardware teams to optimize silicon-package-board performance and pinout. Defines substrate design rules, conducts internal and external reviews, analyzes data, and resolves DRCs to optimize package design. Completes documentation and collateral into the product lifecycle management system of record. Required Skills and Experience: Self-motivated engineer who has strong technical background in design and electrical analysis. Solid background in semiconductor fabrication and packaging Strong analytical ability and problem-solving skills: identifying, isolating, and debugging issues and providing creative solutions. - Ability to work independently and at various levels of abstraction Strong organization, time management, and communication skills, self-motivated. Experience with design and electromagnetic simulation tools: Mentor, Cadence tools, SPICE, Ansys tools etc. Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx). Experience and knowledge with assembly process, test and characterization techniques preferred

Your Match

How well this role fits your profile.

Company Intel

What employees say

Worked at Intel? Share your experience

Interested in this role?

Apply on the company's website.

Cover LetterConnect