Senior Process Engineer - Dry Etch

Responsibilities

• Technology Development & Manufacturing
• Drive technology development initiatives that enable both high-volume manufacturing and future technology advancement
• Provide comprehensive process integration and equipment solutions
• Conduct feasibility studies to meet target device specifications
• Lead design and development of sophisticated manufacturing processes, including material selection , parameter optimization, equipment metrology, and system design
• Process Optimization & Innovation
• Optimize production output for existing products
• Partner with key equipment and materials suppliers to develop enabling technology elements
• p erform process technology feasibility studies using theoretical simulations and practical engineering methods
• Industry Leadership & Strategic Vision
• Stay current with industrial process and material manufacturing trends
• Develop insights into future Intel process technology needs
• Partner with vendor ecosystem to build cost-sensitive technology roadmaps
• Influence and drive technical direction across Intel and the broader industry
• Technical Leadership & Mentorship
• develop and mentor technical leaders within the organization
• Act as a change agent while modeling Intel values
• Align organizational goals with technical vision and formulate strategic technical direction
• Demonstrate proven execution in bringing products and technologies to market
• Collaboration
• This role involves close collaboration with Logic Technology Development (LTD) and Technology and Foundry Supply Manufacturing (TFSM) teams to support a comprehensive range of applications and customer requirements.

Requirements

• Bachelor's degree in Electrical Engineering , Physics, Material Science or in a STEM related field of study
• 7+ years of hands-on experience in CMOS device engineering, device physics, logic architecture, and interconnect development on leading-edge nodes
• Direct etch experience in advanced CMOS device technology
• Knowledge of Design of Experiment (DOE) principles and engineering data analysis tools
• Semiconductor foundry experience
• Advanced degree (MS/PhD) in Electrical Engineering, Physics, Material Science or in a STEM related field of study
• Hands-on experience with sub-3nm Gate-All-Around (GAA) FETs
• Experience in ramp and high-volume manufacturing environments
• Experience with industry standards and certifications
• Experience with device parametric data generation and analysis
• Demonstrated success in foundry New Product Introduction (NPI) activities and complex tape-out troubleshooting
• Experience in product data interpretation, root cause analysis, and solution development
• Why Join Intel MDCE?
• Join us in driving the next generation of semiconductor manufacturing excellence and advancing Intel's position as a global technology leader.
• Job Type:
• Experienced Hire
• Shift:
• Shift 1 (United States of America)
• Primary Location:
• US, Oregon

Benefits

Additional Information

Job Details: Job Description: Organization Overview Manufacturing Development Customer Engineering (MDCE) is Intel's newest organization within Intel Foundry Technology Manufacturing (FTM). We bridge the critical gap between Technology Development (TD) and High-Volume Manufacturing (HVM), advancing technology nodes from initial product qualification to high-yield production across multiple products while enhancing technologies for our foundry customers. Intel's Chandler, Arizona facility is constructing state-of-the-art fabrication facilities for cutting-edge technology nodes, including Intel 18A and beyond. Additionally, we're developing legacy technologies with foundry partners to launch HVM operations serving global foundry customers. Position Summary We seek an experienced Senior Process Engineer - Dry Etch to join our MDCE team and help build a world-class Foundry Customer Engineering organization. This role focuses on Integration and Device engineering across various Intel technologies, including 18A, to serve our global foundry customer base. The position requires extensive hands-on experience with sub-3nm Gate-All-Around (GAA) FETs and front-end dry etch processing.

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Company Intel

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