Technologist

Requirements

• Member of technical staff at existing job role or Senior Staff member
• Experience in VLM and Nvidia hw and learning models
• Expert in Machine learning and industrial vision
• >7 years of experience with a proven track record of demonstrated leadership overseeing relevant functions and teams
• Experience in semiconductor production capital equipment development for measurement, product and customer solutions, customer engagement, program and project management, and product roadmap steering
• Advanced degree, such as Masters in Physics, or PhD in Mathematics, and Engineering is a plus.
• Doctorate (Engineering, Math) with a minimum of 7 years of experience OR
• Master's Level Degree Physics with a minimum of 7 years of experience OR
• Lead demo support in Xray inspection and data analysis at tier 1 sites Micron, Samsung, tsmc, Intel to win sockets for advanced inspection
• Salary Ranges
• $209,502.02 - $303,746.89
• Individual pay is determined based on multiple factors, including but not limited to location, experience, skills, job-related knowledge, relevant education, certifications

Benefits

Additional Information

Let's search for your next career at TEL. Use the form below to search our current opportunities and then apply. Please consider joining our Talent Community so that we may continue to engage with you. Job Description The TEA R&D (former Timbre) team is looking for a head of algorithms & leading edge industrial computer vision application development. The selected leader will join a dynamic development team as a key member of senior staff with responsibilities for creating unit algo's and methods and have integration knowledge into tool control software systems leading to "lights out" applications for the team, in future they will manage data and application development Engineers and Scientists, and grow to support Tier 1 semiconductor customers world wide with the developed solutions. Responsibilities include but are not limited to: Set direction and architectures to guide leading edge computer vision subsystems and algorithms leading to applications for x-ray imaging techniques, and optical film metrologies, and training engineering peers in the new applications world wide (activities initially based in US, and S. Korea, Japan, Taiwan, and growing into SEA) Hire and grow a Method and Algorithm Development Engineering Team to meet the product line growth cadence, keeping up with the latest trends such as Nvidia's VLM, largest learning complexity models and morphing use cases to semiconductor inspection, metrology and process control for advanced 3DI bonding and post bonding overlay. Provide vision and leadership to enter new markets and support active application demos with Tier 1 semiconductor customers and help guide business growth; with a primary focus to deliver a novel xray inspector utilizing phase contrast and small angle scatter. Provide technical guidance to TEL factories and business units, and actively participate in product roadmap decisions Drive development of leading-edge solutions for advanced FEOL node layers and 3DI application nodes applying key knowledge in industrial computer vision, and novel algorithms to enhance TEL's process with "smart architectures"; create and utilize digital twin for equipment to announce upcoming PM's and diagnostics for installed fleets of tools. Develop near term and long term strategy to grow applications support to customers at different regions worldwide based on development methods and algorithms for metrology, inspection, and process. Lead key customer collaboration and technical programs for product solutions development, customer research and development, and production adoption. This includes evaluation, demos, and meeting customers' long term needs with roadmap planning with Intel, tsmc, and Samsung being the first tier. Develop Customer Engagement Application Engineering team training; train the trainers and engineers in TEL factories and field support teams. Expand Application Engineering best known methods to new product lines as Timbre executes new metrology and sensing product roadmaps; and TTCA for advanced light sources, lithography beyond HNA EUV, and advanced topics in 3DI bonding, such as shape control on die prior to bonding. Develop strong analytic practices, and data analysis with highest data integrity and characterization applications and calibration methods for instrumentation, beginning with a suite of xray architecture calibration for Minuku X. Must have developed algorithms for Xray inspection and metrology Realtime operating system and state machine integration experience of algorithms Knowledge of latest hardware acceleration for Realtime use of algorithms during fast MAM times (secs and sub second time scales) Proactively work with algorithm team to develop new techniques and approaches in addressing gap layer solutions >15% travel expected, visiting external and internal key stakeholders, and customers worldwide.

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Company Intel

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