Senior/Principal EDA Engineer, Electronic Design Automation, Texas Institute for Electronics

Responsibilities

• Senior EDA Engineer
• Support the EDA implementation roadmap for TIE; multi-component and chiplet integration platforms, working hands-on with design kits, simulation tools, and reference flows.
• Develop and maintain comprehensive process design kits (PDKs) and assembly design kits (ADKs), including modeling, verification, and enablement collateral to accelerate customer adoption.
• Work directly with EDA tools (Synopsys, Cadence, Ansys, Siemens) and packaging design teams to integrate electrical, thermal, and mechanical simulation workflows. Serve as a technical resource in design reviews and customer engagements.
• Work on Jira, Version Control tools to enable the Internal and External Development teams.
• Apply AI based deployment of the EDA flows, PDK development.
• Collaborate with engineering, packaging design, product marketing, and EDA vendors to ensure design enablement flows are validated, documented, and continuously refined.
• Create detailed technical documentation, user guides, reference flows, and onboarding materials to support customer design teams.
• Assist in program planning activities covering scope, schedules, risk mitigation, and resource allocation to support predictable execution.
• Monitor EDA market trends and competitive developments, providing technical insights to guide tool integration decisions and platform improvements.
• Support program transparency and accountability, ensuring technical deliverables are on track and stakeholders are informed of progress and risks.
• Principal EDA Engineer
• Drive the strategic vision and implementation roadmap for EDA across TIE; multi-component and chiplet integration platforms-spanning design kits, simulation tools, and reference flows from concept to production deployment.
• Lead technical development of comprehensive process design kits (PDKs) and assembly design kits (ADKs), including multi-physics modeling, qualification strategies, and customer enablement collateral. Own roadmap decisions and quality standards.
• Set technical direction for EDA packaging workflows, establishing best practices and qualification criteria that span electrical, RF, thermal, and mechanical simulation domains. Represent TIE as a technical authority in industry working groups, customer design reviews, and ecosystem partnerships.
• Manage relationships with TIE subcontractors, vendors, and EDA partners (Synopsys, Cadence, Ansys, Siemens). Define clear Statements of Work (SoW) with quantifiable metrics, monitor milestone progress, and adjust deliverables and payable milestones as needed to ensure accountability.
• Drive cross-functional collaboration with engineering, packaging design, product marketing, and major EDA vendors to align design enablement flows, establish validation protocols, and continuously improve platform capabilities.
• Develop and execute detailed program plans covering scope, schedules, risk mitigation, resource allocation, and customer communication. Deliver predictable

Benefits

Additional Information

Job Posting Title: Senior/Principal EDA Engineer, Electronic Design Automation, Texas Institute for Electronics ---- Hiring Department: Texas Institute for Electronics ---- Position Open To: All Applicants ---- Weekly Scheduled Hours: 40 ---- FLSA Status: To Be Determined at Offer ---- Earliest Start Date: Ongoing ---- Position Duration: Expected to Continue ---- Location: PICKLE RESEARCH CAMPUS ---- Job Details: General Notes About TIE Texas Institute for Electronics (TIE) is a transformative, well-funded semiconductor foundry venture combining the agility of a startup with the scale of a national initiative. Our Mission A key part of our mission is to advance the state of the art in 3D heterogeneous integration (3DHI), chiplet-based architectures, and multi-component microsystems- catalyzing breakthroughs across microelectronics, artificial intelligence, quantum computing, high-performance computing, and next-generation healthcare devices. Our Impact Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, we are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing. Our Technology Our 3DHI and chiplet integration platforms integrate novel thermal management and advanced interconnect solutions to deliver unprecedented performance and energy efficiency. Operating at the intersection of defense electronics and commercial markets, TIE offers a rare opportunity to reimagine an industry from the ground up and build transformative products with global impact. Purpose The Principal EDA Engineer will drive the hands-on implementation of electronic design automation (EDA) solutions for TIE's multi-component and chiplet integration platforms. The Principal Engineer will focus on developing and optimizing design kits, simulation methodologies, and reference flows from concept to deployment, acting as a key technical contributor and innovator.

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