Technology Development Quality & Reliability Engineer(only to new college graduates)

Requirements

• Preferred candidate will have worked on projects related to semiconductor packaging from both mechanical and electrical integrity perspective

Additional Information

ESSENTIAL DUTIES AND RESPONSIBILITIES: The Engineer defines, develops and qualifies new semiconductor packages and maintains quality of existing packages. Represents Package Engineering in cross-functional teams and ensures that packages are characterized, qualified and introduced into production in a timely manner while meeting all electrical, performance, reliability and quality requirements. Take responsibility for product DPPM, as well as new Technology development programs and new NAND/ASIC development Quality and Reliability. Develop a comprehensive quality guidance library encompassing engineering work criteria, statistical Design of Experiments (DOE), Scorecard, sampling plans, and metric/methodology instructions. Address quality cases in technology and product development using DMAIC, RCA, and 8DR methodologies. Coordinates with factories worldwide on the high-volume introduction of new packages and assembly processes. Manages assembly yield improvement and package cost reduction programs. REQUIRED: This position requires a candidate with MS / PhD degree in Mechanical/Materials Engineering Knowledge of semiconductor packaging highly desired PREFERRED: Knowledge of coding, AI tools, finite element analysis (FEA), design of experiments (DoE), statistical methods, and package failure analysis techniques is required Ability to multi-task and meet tight deadlines as well as excellent communication and interpersonal skills required

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Company Intel

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