Manufacturing Engineer

Responsibilities

• Develop, document, and maintain manufacturing processes and routers for solder mount technology (SMT) assembly, die attach and wire bonding operations as well as module assembly
• Provide hands-on floor support to troubleshoot process and equipment issues in real time
• Identify and implement continuous improvement initiatives to increase yield, throughput, and first-pass quality on legacy programs
• Support new product introduction (NPI) by developing repeatable, producible processes for new hardware
• Train and mentor production assemblers and technicians on process steps, equipment operation, and quality standards
• Collaborate with design, quality, and program engineering teams to resolve producibility issues and drive design-for-manufacturability improvements
• Generate and maintain work instructions, process specifications, and travelers in compliance with internal quality systems and customer requirements
• Support root cause and corrective action (RCCA) investigations for process-related nonconformances
• Participate in equipment qualification, process validation, and first article inspection activities
• Required Qualifications
• Bachelor's degree in Manufacturing, Electrical, Mechanical, or Industrial Engineering (or equivalent hands-on experience) or Electrical Engineering Technology degree
• 3 to 5 years' experience in microelectronics manufacturing setting with an emphasis in SMT and chip and wire
• Strong hands-on troubleshooting skills and comfort working directly on the production floor. Experience in process implementation and improvement are key.
• Ability to read and interpret production and engineering CAD drawings, BOMs, and process specifications
• Strong communication skills and experience training/mentoring production staff
• U.S. Person status is required for export-controlled work
• Preferred / Bonus Skills
• Experience with wire bonding processes (wedge and/or ball bond) and bond pull/shear testing
• Familiarity with die attach processes and epoxy selection/curing characteristics
• Strong understanding of hand and machine soldering to J-STD-001/IPC-A-610 standards with components down to 0201 as well as BGA and QFNs. IPC certifications (e.g. J-STD-001, IPC-A-610, IPC/WHMA-A-620) is a bonus.
• Experience with hermetic package assembly and seal processes
• Experience programming and operating Onyx (or similar) automated solder stations
• Knowledge of hermeticity testing (fine/gross leak) and related acceptance criteria and familiarity with hydrogen getter materials and their role in hermetic package moisture control
• Familiarity with common MIL standards and their application
• Experience supporting DoD or aerospace programs and familiarity with AS9100 quality systems as well as ESD protocols
• Experience with mechanical environmental screening such as shock, vibration, temperature cycling and burn in
• 6 Sigma Certification
• Work Environment / Physical Requirements
• Regular presence on the production floor in a controlled/cleanroom-adjacent environment
• Ability to use microscopes, temperature plates and fine-motor tools for extended periods
• Equal Opportunity Employer/Protected Veterans/Individuals with Disabilities
• Third-Party Recruiters
• Please note, that per Spectrum Control Policy, we do not accept unsolicited resumes from third-party recruiters u

Benefits

Additional Information

At Spectrum Control, most departments operate on a 4-day, 10-hour work schedule in exchange for a 3-day weekend . We offer competitive wages and PTO, plus our benefits begin on day 1 of employment. Come join a workforce where we put you first! Job Description : The Manufacturing Engineer will provide hands-on factory support to find creative solutions for legacy program efficiency improvements and new process integration for new products. The Manufacturing Engineer works closely with production leadership, engineers, and technicians to train production assemblers, develop processes, and create/maintain routers. This engineer reports to production and is responsible for supporting revenue growth as well as new process introduction for cutting-edge hardware in a defense electronics manufacturing environment. Products range from small hybrid assembly to complex box level integrated systems.

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