Senior Hardware Design Engineer, High Speed Networking

Responsibilities

• Candidates for this position would be responsible for the entire hardware design process:
• Authoring functional specifications of high power and high density Ethernet switches used in AI networks
• Selecting and qualifying components
• Schematic capture and tool-based design verification
• Working closely with eCAD teams on PCB layout and component footprints
• Working with internal teams to run (or run your own) signal integrity simulations on both power and datapath signals
• Working closely with mechanical and thermal engineers on the system general arrangement and physical realization
• Specifying PCB stackup and fabrication details with various PCB vendors
• Working with internal teams to develop (or develop your own) programmable logic devices for control and timing planes
• Working closely with local and overseas Contract Manufacturers (CM), from proto through production
• Lab bring up and debug of prototypes
• Working closely with diagnostics software engineers on both design validation and manufacturing test development
• Driving complex system debug between software, hardware, and test teams
• Training CM for high yield test and manufacturing
• Guiding groups of engineers and mentoring younger engineers
• BSEE or MSEE
• 10+ years of relevant experience in hardware engineering
• Experience designing networking hardware, particularly involving 100G and 200G PAM4 Ethernet switching
• Embedded x86/ARM system design is highly desirable
• Experience designing 20+ layer count boards featuring 50G+ signals, and advanced PCB manufacturing technologies such as sequential lamination, HDI, and ultra-low-loss materials
• Experience working with multi-phase DC/DC's for high current, high transient loads
• Experience working with high speed interfaces, such as DDR, PCIe
• Writing specifications and drawing schematics for high complexity boards
• Working closely with CAD designers on complicated layout and routing
• Working closely with Software and test engineers to bring-up and debug systems
• Familiarity with signal integrity and power integrity concepts and tools, such as: impedance, PDN's, differential routing, insertion loss, S-parameters, TDR's, VNA's
• Experience with mass production Design for Manufacturability (DFM)
• FPGA design and system simulation using Verilog and or VHDL
• Working with Contract manufacturers
• Successfully taking products from concept to production
• #LI-FI1

Additional Information

Who You'll Work With Working closely with cross-functional teams including software, product management, marketing, and manufacturing, our engineers innovate new system architectures and develop high-speed PCBs requiring state-of the-art signal integrity and power integrity design practices.

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Company Intel

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