Senior/Staff Packaging Development Engineer
External
Monolithicpower · San Jose, CAPrepare for this interview
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Requirements
- BS or MS degree in Mechanical, Material Science, Electrical Engineering or related engineering degree.
- 5+ years of experience in design of packages and modules.
- Proficiency in CAD software: Auto CAD and SolidWorks preferred.
- Deep understanding in various packaging technologies, process flow, material, qualification and manufacturing implementation.
- Knowledge of thermal, electrical and mechanical finite FEA/CFD simulation software tools and simulation methods used for semiconductor packaging and board level applications.
- ANSYS Icepak/Q3D/Mechanical Preferred.
- System level simulation skill is a plus.
- Excellent communication, writing and presentation skills.
- Strong innovation, problem solving mindset.
Benefits
Additional Information
Monolithic Power Systems, Inc. (MPS) is one of the fastest growing companies in the Semiconductor industry. We are worldwide technical leaders in Integrated Power Semiconductors and Systems Power delivery architectures. At MPS, we cultivate creativity, are passionate about sustainability, and are committed to providing leading-edge products and innovation to our customers. Our portfolio of technology helps power our world ---come join our team and see how YOU can make a difference. Job Description: Package/Power Module and Packaging Technology Development Essential Functions: Design, develop and scale to volume production of new packages and modules for the industrial, automotive, renewable and telecom markets. The candidate can understand system requirements and build these into the definition of the package/power module to meet electrical, thermal, and mechanical specifications. Capabilities to independently use simulation software. Interact with internal cross-function teams, subcontractors and material suppliers to develop new packages, assembly processes and technologies. Optimize the assembly materials and processes with best package performance & reliability, maximize manufacturing yield, and minimize assembly cost. Benchmark the competitions in package design, assembly materials and assembly processes, and c reate a new methodology, technology and intellectual property. Direct support for multiple product lines and customers.
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