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Manufacturing Failure Analysis Engineer

External
Intel logoIntel · Penang, Malaysia
Full-timeOn-site1w ago
AssemblyComplianceLeadershipSEMStatistical Analysis
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Responsibilities

  • Conduct failure analysis to identify root causes of issues in manufacturing processes, products, and technologies.
  • Define failure analysis strategies and execute lab work to evaluate electrical and mechanical characteristics of integrated circuits, components, and systems.
  • Develop and implement advanced electrical, analytical, and mechanical methodologies to ensure future-ready failure analysis capabilities.
  • Investigate the interactions between materials and devices to thoroughly understand fundamental failure mechanisms.
  • Recommend corrective actions based on failure reports and drive the proliferation of shared learnings across sites to enhance organizational knowledge.
  • Collaborate with cross-functional teams to enable new technology or product transfers, manufacturing startups, automation, and process improvements.
  • Ensure compliance with Standard Operating Procedures (SOPs) and best-known methods (BKMs) to maintain operational excellence.
  • Coordinate with internal and external partners, including third-party laboratories, to support failure analysis and special investigations.

Requirements

  • Bachelor's or BS degree in Material Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Chemistry or a related field.
  • 3+ years of relevant experience with a Bachelor's degree, 2+ years with a Master's degree, or 0 years with a PhD.
  • Hands-on experience in failure analysis techniques, including defect detection, failure modes analysis, and fault isolation.
  • Proficiency in using electrical, analytical, and mechanical tools and methodologies for failure analysis.
  • Familiarity with ANALYTICAL tools such as SEM, FTIR, Xray or willingness to undergo training.
  • Fundamental understanding of statistical analysis and its application in manufacturing processes.
  • Experience in collaborating with cross-functional teams and external partners, including third-party laboratories.
  • Strong problem-solving skills and the ability to work effectively in a fast-paced, results-driven environment.
  • Demonstrated ability to drive process improvements and innovations in a manufacturing setting.
  • Job Type:
  • Experienced Hire
  • Shift:
  • Shift 1 (Malaysia)
  • Primary Location:
  • Malaysia, Penang
  • Additional Locations:
  • Business group:
  • Posting Statement:

Additional Information

Job Details: Job Description: The Role and Impact Join Intel's Advanced Packaging team as a Manufacturing Failure Analysis Engineer, where you will play a critical role in shaping the future of semiconductor manufacturing. This position is pivotal in ensuring the success of Intel's IDM 2.0 strategy and its global leadership in advanced packaging technologies. You will be instrumental in identifying and resolving failures across next-generation product, package, platform, and board process technologies to drive improvements in quality, yield, and reliability. Your expertise will directly contribute to innovative solutions that help connect and enrich the lives of people around the world.


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