Die Bond Process Engineer

Responsibilities

• Operate, qualify, and optimize Die Bond equipment and manufacturing processes.
• Establish, validate, and maintain process parameters and machine recipes.
• Monitor process performance, yield, and quality metrics to ensure production targets are achieved.
• Lead process improvement initiatives to enhance:
• Yield
• Throughput
• Equipment utilization
• Cycle time
• Manufacturing cost
• Conduct process characterization and capability studies.
• Investigate manufacturing issues and implement corrective and preventive actions (CAPA).
• Support New Product Introduction (NPI), process transfer, and pilot production builds.
• Work closely with Product Engineering, Quality, Manufacturing, Test, and Equipment teams to resolve technical issues.
• Develop and maintain SOPs, Work Instructions (WI), process flow documentation, and training materials.
• Participate in equipment qualification, acceptance testing, and process validation activities.
• Ensure compliance with quality, safety, and ESD requirements.

Requirements

• Education
• Bachelor's degree or above in Mechanical Engineering, Manufacturing Engineering, Industrial Engineering, Materials Science, Electronics Engineering, or a related technical discipline.
• 5+ years of hands-on die bonding experience in semiconductor packaging or optoelectronics manufacturing.
• Experience in high-volume manufacturing environments is preferred.
• Technical Skills
• Strong understanding of die attach processes, including:
• Epoxy Die Bonding
• Eutectic Die Bonding
• Flip-Chip Assembly
• Hands-on experience with die bond equipment.
• Ability to perform equipment setup, parameter optimization, troubleshooting, and preventive maintenance.
• Understanding of process characterization and statistical process control (SPC).
• Knowledge of semiconductor packaging materials and assembly processes.
• Familiarity with DOE, FMEA, PFMEA, and root cause analysis methodologies is an advantage.
• Soft Skills
• Strong analytical and problem-solving skills.
• Good communication and cross-functional collaboration abilities.
• Proficient in Microsoft Excel, PowerPoint, and data analysis tools.
• Ability to work effectively in a fast-paced manufacturing environment.

Additional Information

Position Summary The Die Bond Process Engineer is responsible for developing, optimizing, and sustaining die attach processes used in optical transceiver manufacturing. This role focuses on equipment setup, process control, yield improvement, new product introduction (NPI), and continuous manufacturing excellence.

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Company Intel

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