Sr. Principal Semiconductor Device Engineer (FinFET Technologies)

Responsibilities

• Technology Leadership & Device Strategy
• Define and drive device architecture, scaling strategies, and performance targets for advanced FinFET technologies
• Lead device-level tradeoff analysis (performance, power, variability, reliability) across technology nodes
• Provide technical leadership in design-technology co-optimization (DTCO) and influence product architecture decisions
• Shape long-term device roadmap in alignment with product and foundry capabilities
• Foundry Engagement & Technology Enablement
• Act as the primary technical interface with external foundries (e.g., TSMC, Samsung)
• Drive alignment on PDKs, device models, design rules, and process changes
• Negotiate and influence device/process optimization strategies with foundry partners
• Lead periodic technical reviews (QTR/QBR) and escalation for yield or performance issues
• Silicon Analysis, Yield & Performance Optimization
• Lead silicon validation and correlation (SPICE-to-silicon, TCAD-to-silicon)
• Drive parametric yield improvement, variability reduction, and failure analysis
• Identify root causes of performance/reliability issues and define corrective actions
• Guide teams on statistical analysis, DOE strategy, and data interpretation
• Cross-Functional Collaboration & Execution
• Lead collaboration across device, process integration, circuit design, reliability, and product teams
• Provide technical direction for test structures, characterization plans, and design enablement
• Support tape-out readiness, product bring-up, and qualification
• Mentor junior engineers and provide technical leadership across global teams
• Program & Stakeholder Leadership
• Drive complex, multi-site programs with external foundries and internal stakeholders
• Communicate technical results and recommendations to executive leadership and partners
• Balance technical risk, schedule, and business priorities to enable successful product delivery
• Required Qualifications
• Education
• PhD in Electrical Engineering, Physics, Materials Science, or related field
• (MS with extensive experience also considered)

Requirements

• 8-12+ years of experience in semiconductor device engineering, technology development, or process integration
• Proven track record in advanced CMOS/FinFET nodes (e.g., ≤16nm or equivalent complexity)
• Demonstrated experience working with external semiconductor foundries in development and/or production
• Technical Expertise
• Deep understanding of semiconductor device physics and transistor behavior
• Strong background in: FinFET device architecture and scaling challenges
• Device characterization (DC/AC), compact modeling, and variability
• Yield analysis, failure analysis, and reliability physics
• SPICE, TCAD, and data analysis tools
• Experience with: PDK/device model validation
• Silicon debug and correlation
• DOE and statistical analysis methodologies
• Experience with 16nm and below nodes or emerging device architectures (e.g., GAA/nanosheet)
• Background in DTCO and product-driven technology optimization
• Familiarity with automotive-grade qualification (AEC-Q100) or high-reliability applications
• Prior leadership of technology transfer or high-volume manufacturing ramp
• Experience influencing foundry roadmaps or joint development programs
• Leadership & Behavioral Competencies
• Demonstrated ability to lead through influence (internal and external)
• Strong technical judgment and decision-making under ambiguity
• Ability to translate deep technical insights into business-relevant outcomes
• Excellent communication skills across engineering and executive audiences
• Proven track record of mentoring and scaling technical teams
• Impact of the Role
• Direct ownership of device technology success at advanced nodes
• High visibility role with foundry partners in Hsinchu ecosystem
• Significant influence on product competitiveness, cost, and manufacturability
• Opportunity to shape next-generation semiconductor platforms
• More information about NXP in Greater China...
• #LI-7743

Additional Information

Job Summary We are seeking an experienced Sr. Principal Semiconductor Device Engineer to lead technology enablement in NXP in close collaboration with leading semiconductor foundries . This role requires deep expertise in device physics, advanced node technologies, and silicon validation , combined with the ability to drive cross-functional programs and influence external partners . You will play a key role in defining device requirements, guiding technology development, and ensuring successful product execution from concept through high-volume manufacturing.

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