Sr Staff Package Design Engineer

Responsibilities

• Develop hermetic, ceramic, metal, radiation-tolerant, and Class P plastic package technologies and interconnect methods for commercial space, aerospace, and high-reliability power applications.
• Define package technology requirements, tooling needs, process flows, and qualification plans for new and existing package platforms.
• Benchmark, select, and qualify materials, assembly processes, and subcontractors, including OSAT partners and Renesas' in-house Palm Bay assembly site.
• Partner with Renesas product design teams to develop detailed package drawings for hermetic and plastic packages using AutoCAD.
• Work with OSAT partners and internal manufacturing teams to run DOE activities, optimize assembly processes, and establish process specifications.
• Collaborate with product engineering, program management, and reliability teams to qualify new packages and processes within required project schedules.
• Maintain technical expertise on advances in hermetic, ceramic, metal, radiation-tolerant, and Class P plastic packaging technologies.
• Participate in packaging roadmap development, with a focus on execution, manufacturability, reliability, and long-term package strategy.
• 5-12 years of relevant experience in semiconductor package development, with emphasis on hermetic, ceramic, metal, radiation-tolerant, or Class P plastic packaging.
• Experience with semiconductor IC assembly processes, materials, package technologies, and package qualification.
• Familiarity with high-reliability, aerospace, commercial space, or defense-related semiconductor packaging requirements.
• Experience working with external package suppliers, OSAT partners, or internal assembly/manufacturing sites.
• Knowledge of AutoCAD and Microsoft Office tools, including Excel, PowerPoint, and Word.
• Strong communication, analytical, presentation, and cross-functional collaboration skills.
• Familiarity with MIL-STD-883, MIL-PRF-38535, and MIL-STD-750 standards.
• Education
• Bachelor's, Master's, or Doctorate degree in Physics, Chemistry, Mechanical Engineering, Electrical Engineering, Materials Engineering, or a related technical field.
• At Renesas, you can:
• Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.
• Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people's lives easier, safe and secure.
• Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day.
• Are you ready to own your success and make your mark?
• Join Renesas. Shape Your Future with Us .
• Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursu

Benefits

Additional Information

Renesas is seeking a Sr. Staff Package Design Engineer to support advanced package technology development for commercial space, aerospace, and high-reliability power applications. This role will focus on hermetic, ceramic, metal, radiation-tolerant, and Class P plastic packaging solutions, working closely with product design, reliability, OSAT partners, in-house assembly teams, and key package suppliers to define, develop, qualify, and optimize package technologies for demanding high-reliability environments.

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