Software Development and AI for Chip Package Board Codesign (w/m/div)
External
Infineon Technologies Ag · Villach, KärntenFull-timeOn-site3w ago
Prepare for this interview
EliteAI-generated questions, company research, and talking points tailored to this role
About the role
Software Development and AI for Chip Package Board Codesign (w/m/div) Job Family Research & Development Type of employment Full time Duration of employment Permanent Preferred start date 2026-06-15 Join As Professional (incl. Management Positions) Is this position eligible for Hire4IFX? No WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problemsolvers behind tomorrow's technology. Being responsible for Software Development and AI for Chip Package Board Codesign on...
Your Match
How well this role fits your profile.
Company Intel
What employees say
Worked at Infineon Technologies AG? Share your experience