HAMR Optical/Plasmonic Device Fabrication Engineer/Scientist

Requirements

• Exposure to wafer-level characterization such as SEM, FIB, TEM, AFM and ellipsometry is desirable
• Problem-solving and analytical skills
• Expertise in JMP or equivalent data analysis software
• Candidate must be innovative, detail-oriented and have strong oral and written communication skills
• Excellent teamwork and people skills are required.
• Salary Range
• 115,200.00-153,600.00
• #LI-MT
• Compensation & Benefits Details
• The salary range is what we believe to be the range of possible compensation for this role at the time of this posting. We may ultimately pay more or less than the posted range and this range is only applicable for jobs to be performed in California,

Benefits

Additional Information

The WD R&D center in Fremont, CA is a world-class research laboratory, wafer fab and manufacturing center at the intersection of San Francisco Bay and Silicon Valley. WD labs are at the forefront of AI-infrastructure R&D, where activities focus on all aspects of information-storage technology. We are inviting applications for a position in optical-device-fabrication on the HAMR-fabrication team, where our mission is to continue the advance of Heat Assisted Magnetic Recording (HAMR). This is an opportunity to work where magnetic, optical and plasmonic devices converge on a nanoscale. We have the capabilities of a fully-functional cleanroom with state-of-the-art equipment and a 24/7 support staff. ESSENTIAL DUTIES AND RESPONSIBILITIES Work as a Research Scientist and Engineer in optical-device-fabrication at WD's wafer fab in Fremont, CA. Candidate will be responsible for development and integration of new processes for fabrication of HAMR devices. Job requires interfacing with engineers and scientists in process, characterization and design groups. REQUIRED PhD in Engineering, Chemistry, Materials Science, or Physics Minimum of four-years experience in semiconductor, optical/plasmonic and/or magnetic device fabrication Expertise in wafer processes such as lithography, wet etching, ion milling, reactive etching, thin films and CMP

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